Stacked Die ID Assignment via TSV and Bonding Pads

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Solution Overview

Problem

In stacked microelectronics packages, existing technologies face challenges in efficiently assigning unique device IDs to each integrated circuit die and detecting the total number of dice within the stack, which is crucial for addressing and interconnecting devices effectively.

Innovation Solution

The implementation of circuitry within each die that generates a unique device ID value using through-substrate vias (TSVs) and conductive bonding pads, along with assignment and evaluation devices, allows for automatic ID assignment and detection of the total number of dice, enabling efficient addressing and interconnection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If manual device ID assignment and die counting methods are used in stacked packages, then device identification can be achieved, but the process is time-consuming and reduces productivity

Engineering Contradiction:

Improvedevice ID assignment efficiencyVSAvoidtime for ID assignment and die counting

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The system performs self-identification where each die automatically generates its own device ID and the stack automatically counts its own dies through electrical connection detection, eliminating the need for manual external programming and counting processes

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

Device IDs are generated and stored in non-volatile memory before the dies are stacked, and the total die count is determined during the stacking process itself, preparing identification data in advance to avoid post-assembly programming time

Inventive Principle:

Principle #10Preliminary action

2Adaptability or versatility

If unique device IDs are assigned to each die in a stack, then device addressing capability is improved, but device complexity increases

Engineering Contradiction:

Improvedevice addressing capabilityVSAvoidcomplexity of ID assignment circuitry

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The device ID generation circuitry is merged with the existing non-volatile memory structure, using the same memory cells and programming mechanisms that are already present for data storage, thereby avoiding additional dedicated ID storage hardware

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The same memory programming mechanisms and electrical connection detection circuits are used for multiple purposes: programming device IDs, storing data, and determining total die count, eliminating the need for separate dedicated circuits for each function

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of manufacture

If through-substrate vias and conductive bonding pads are used for ID assignment, then manufacturing precision requirements increase

Engineering Contradiction:

Improveautomated ID assignment processVSAvoidvia and bonding pad alignment precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

Conductive bonding pads serve as intermediary elements that provide robust electrical connection between dies and through-substrate vias, accommodating normal manufacturing tolerances through their larger surface area and flexible connection geometry

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The conductive bonding pads are designed to completely cover the through-substrate vias, creating a nested structure where the via is embedded within the pad, ensuring reliable electrical connection while tolerating positional variations within manufacturing tolerances

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS9478502B2Device identification assignment and total device number detection

Publication Date: 2016.10.25 MICRON TECHNOLOGY INC

AI summary

Various embodiments comprise apparatuses to assign a respective one of a sequence of unique device identification (ID) values to each die in a stacked device. In an embodiment, each die may include a respective assignment device to operate on an input and generate, as an output, the respective one of the sequence of the unique device ID values. Each die may also include a respective evaluation device to detect a total number of dice in the stack. Additional apparatuses and methods are described.