Stacked Die ID Assignment via Inter-Die Control Transfer
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Solution Overview
Problem
Conventional methods for assigning identification (ID) to semiconductor dice in stacked memory devices, such as wire bond programming and fuse programming, are inefficient, especially when dice lack wire bonds, and require additional record-keeping efforts.
Innovation Solution
A system where control information is transferred through connections between dice to assign unique IDs, using logic components and AND gates to manage ID assignment, allowing for sequential or parallel transfer of ID bits, enabling efficient ID assignment without the need for wire bonds and reducing record-keeping complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wire bond programming is used to assign ID to dice, then ID assignment can be performed, but it becomes unsuitable when dice lack wire bonds
Solution Approach 1:
The patent introduces an intermediary mechanism (connection structure) that transfers control information between dice without requiring wire bonds on each die. This mediator enables ID assignment to work with stacked dice that lack traditional wire bond connections, resolving the adaptability issue while maintaining manufacturing feasibility.
2Ease of manufacture
If fuse programming is used to assign ID to dice, then ID can be assigned before stacking, but additional record keeping is required which creates additional work
Solution Approach 1:
The patent enables the dice stack itself to serve as the record-keeping mechanism. The control information flows through the connection structure between dice, allowing the system to automatically track and assign IDs without external record-keeping processes. This self-service approach eliminates the additional work associated with manual tracking while maintaining manufacturing flexibility.
3Productivity
If conventional ID assignment methods are used for stacked dice, then ID can be assigned, but the process is inefficient and requires additional record keeping
Solution Approach 1:
The patent merges the ID assignment process with the existing connection structure between stacked dice. By combining these functions, the system achieves efficient ID assignment without requiring separate record-keeping processes or additional manufacturing steps, thereby improving productivity while reducing overall process complexity.
Data Source
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AI summary
Some embodiments include apparatus and methods having dice arranged in a stack. The dice include at least a first die and a second die, and a connection coupled to the dice. The connection may be configured to transfer control information to the first die during an assignment of a first identification to the first die and to transfer the control information from the first die to the second die during an assignment of a second identification to the second die.