Stacked-Die Inductor Bonding for Dense Semiconductor Integration
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Solution Overview
Problem
The challenge in semiconductor manufacturing lies in effectively bonding stacked semiconductor devices with sophisticated techniques to enhance integration density while maintaining reliability and reducing physical size, particularly in integrating inductive components within these devices.
Innovation Solution
The semiconductor device incorporates a first and second die with bonding layers containing connecting and dummy members, and an inductor formed by bonding inductive coils within these layers, ensuring electrical connectivity and isolation, thereby facilitating efficient integration and bonding interfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If inductive coils are integrated within bonding layers of stacked semiconductor devices, then integration density is improved, but device complexity increases
Solution Approach 1:
The patent merges the inductor formation process with the existing bonding layer structure. Inductive coils are formed by depositing conductive material patterns within the bonding layers during the stacking process, combining two functions (bonding and inductance) into a single integrated structure, thereby improving integration density without proportionally increasing complexity
Solution Approach 2:
The bonding layers serve multiple functions: they provide mechanical bonding between stacked dies and simultaneously host the inductive coils. This multi-functionality allows the same structural element to fulfill both bonding and passive component integration roles, enhancing productivity while managing device complexity
2Area of stationary object
If inductive coils are formed within bonding layers, then area utilization is improved, but manufacturing precision requirements increase
Solution Approach 1:
The conductive material patterns for inductive coils are formed within the bonding layers before the stacking and bonding process. This preliminary formation allows precise patterning to be performed when the bonding layer material is in a more manageable state, improving area utilization while managing manufacturing precision requirements through staged processing
3Productivity
If connecting members and dummy members are integrated within bonding layers, then integration density is improved, but reliability challenges increase
Solution Approach 1:
The bonding layer is designed with spatially differentiated regions: connecting members are positioned to establish electrical connections between stacked devices, while dummy members are positioned to provide mechanical support and stress distribution. This local differentiation optimizes integration density while addressing reliability concerns through specialized functional zones within the same layer
Data Source
AI summary
A semiconductor device includes a first die having a first bonding layer; a second die having a second bonding layer disposed over and bonded to the first bonding layer; a plurality of bonding members, wherein each of the plurality of bonding members extends within the first bonding layer and the second bonding layer, wherein the plurality of bonding members includes a connecting member electrically connected to a first conductive pattern in the first die and a second conductive pattern in the second die, and a dummy member electrically isolated from the first conductive pattern and the second conductive pattern; and an inductor disposed within the first bonding layer and the second bonding layer. A method of manufacturing a semiconductor device includes bonding a first inductive coil of a first die to a second inductive coil of a second die to form an inductor.