Stacked Die Interposer Signal Routing for Uniform Power Delivery
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Solution Overview
Problem
As the number of devices in electronic products such as computers and cellular phones increases, effectively delivering electrical signals among them becomes a challenge, particularly in ensuring uniform signal distribution and efficient communication within integrated circuit (IC) packages.
Innovation Solution
The use of an interposer and structure portions within the IC package to transfer signals between devices, including power, data, address, and control signals, improves signal delivery by distributing power signals uniformly and allowing for flexible signal routing through conductive paths and vias, even in configurations with stacked dice and multiple layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If devices are stacked in a three-dimensional configuration to increase device density, then the number of devices per unit area increases, but signal delivery uniformity deteriorates due to increased signal path length and resistance
Solution Approach 1:
The patent introduces an interposer as an intermediary component between stacked devices. The interposer contains conductive structures that receive signals from lower devices and redistribute them to upper devices, acting as a signal mediation layer that equalizes signal paths and improves delivery uniformity across the three-dimensional device stack.
Solution Approach 2:
The patent transitions from two-dimensional planar signal distribution to three-dimensional signal routing by incorporating vertical conductive paths through the interposer. This dimensional extension allows signals to be distributed uniformly across multiple stacking levels, resolving the uniformity issue inherent in vertical stacking configurations.
2Device complexity
If conventional direct signal routing is used between stacked devices, then the structure remains simple, but signal distribution uniformity deteriorates due to varying signal path lengths
Solution Approach 1:
The interposer serves as a mediating structure that simplifies the overall signal routing architecture by providing a centralized signal distribution point. Rather than creating complex direct connections between all device pairs, the interposer mediates signal flow, achieving uniform distribution while maintaining structural manageability.
3Adaptability or versatility
If signal paths are extended to reach all devices in a stacked configuration, then all devices can be connected, but signal resistance and power loss increase
Solution Approach 1:
The patent segments the signal path into multiple sections: from device to interposer, and from interposer to target device. This segmentation allows for intermediate signal conditioning and redistribution at the interposer level, reducing cumulative resistance and power loss compared to single long signal paths.
Solution Approach 2:
The interposer acts as an intermediary that provides multiple signal distribution points, allowing signals to be refreshed or redistributed at intermediate stages. This reduces the effective path length and resistance for individual signal segments, thereby reducing overall power loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances signal distribution and communication efficiency within IC packages, ensuring reliable operation even in complex device configurations, and maintains uniformity of signal delivery, particularly for power signals, by using interposers and structure portions to facilitate signal transfer between devices.
Implementation Method 1
The interposer and structure portions within the IC package transfer signals between devices, including power, data, address, and control signals, improves signal delivery by distributing power signals uniformly and allowing for flexible signal routing through conductive paths and vias
Data Source
AI summary
Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.