Stacked Die Package Multi-Contact Interconnect With LDS Resin Routing
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Solution Overview
Problem
Conventional semiconductor device packages, such as stacked die packages, require multiple steps and significant material usage for forming electrical connections, which increases manufacturing costs.
Innovation Solution
The proposed solution involves a stacked die package design with a first resin encapsulating the dies, a conductive layer between the first and second resins, and a second resin covering the conductive layer. This design utilizes a Laser Direct Structuring (LDS) technique to form the conductive layer and vias, reducing material and process complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding technique is used to form electrical connections, then electrical coupling between die and substrate is achieved, but the number of manufacturing steps and material usage increases
Solution Approach 1:
The patent extracts the electrical connection function from the traditional wire bonding process and integrates it directly into the molding compound through embedded conductive elements. The conductive traces are formed within the resin material itself, eliminating the need for separate wire bonding steps and reducing manufacturing complexity while maintaining electrical coupling reliability
Solution Approach 2:
The patent introduces an intermediary conductive layer embedded within the molding compound that serves as a mediator between the die and substrate. This conductive trace layer acts as an intermediate electrical pathway, replacing the need for direct wire bonding and simplifying the overall manufacturing process
2Reliability
If grooves and openings are formed in resin with plating technique, then electrical connections are formed, but material usage and process steps increase
Solution Approach 1:
The patent merges the electrical connection function with the molding compound material itself. The conductive traces are integrated within the resin matrix, combining the structural and electrical functions into a single material system. This eliminates the need for separate grooves, openings, and plating steps, reducing material usage and process complexity
Solution Approach 2:
The molding compound serves multiple functions: it provides mechanical encapsulation, structural support, and electrical conduction simultaneously. The conductive traces embedded within the resin enable the material to perform both protective and electrical connection functions, reducing the need for additional materials and processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of manufacturing steps and material usage, leading to lower production costs and increased efficiency compared to traditional wire bonding techniques.
Implementation Method 1
Laser Direct Structuring (LDS) technique to form the conductive layer and vias
Data Source
AI summary
The present disclosure is directed to a package that includes a plurality of die that are stacked on each other. The plurality of die are within a first resin and conductive layer is on the first resin. The conductive layer is coupled between ones of first conductive vias extending into the first resin to corresponding ones of the plurality of die. The conductive layer and the first conductive vias couple ones of the plurality of die to each other. A second conductive via extends into the first resin to a contact pad of the substrate, and the conductive layer is coupled to the second conductive via coupling ones of the plurality of die to the contact pad of the substrate. A second resin is on and covers the first resin and the conductive layer on the first resin. In some embodiments, the first resin includes a plurality of steps (e.g., a stepped structure). In some embodiments, the first resin includes inclined surfaces (e.g., sloped surfaces).