Stacked Die Package Alignment Using Hybrid Bonding and Through Vias
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently integrating and aligning multiple dies within a semiconductor package, particularly in achieving precise alignment and electrical connectivity while maintaining manufacturing cost-effectiveness.
Innovation Solution
The method involves bonding a second die over a first die using hybrid bonding techniques, forming through vias and alignment marks on the second die, and encapsulating with a dielectric material, followed by the formation of a redistribution structure for electrical connectivity and alignment purposes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If hybrid bonding techniques are used to bond multiple dies, then alignment precision and electrical connectivity are improved, but manufacturing complexity increases
Solution Approach 1:
Alignment marks are formed on the dies before the bonding process. This preliminary action enables precise alignment during bonding without requiring complex real-time alignment systems, thus improving alignment precision while managing manufacturing complexity
Solution Approach 2:
Through vias are formed as intermediary structures to establish electrical connectivity between bonded dies. These via structures serve as mediators that simplify the bonding process by providing predefined connection points, improving electrical connectivity while reducing the complexity of direct die-to-die bonding
2Reliability
If through vias and alignment marks are formed on the second die, then electrical connectivity and alignment are improved, but manufacturing steps and cost increase
Solution Approach 1:
Through vias and alignment marks are formed during the same manufacturing sequence on the second die. By merging these two features into a single process flow, the patent improves electrical connectivity and alignment while minimizing the increase in manufacturing steps and cost
3Adaptability or versatility
If multiple dies are integrated within a single package, then functionality and performance are improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent divides the semiconductor system into multiple separate dies that are subsequently bonded together. This segmentation allows each die to be manufactured independently using standard processes, improving overall functionality while managing manufacturing complexity by avoiding the need to manufacture complex multi-die systems in a single step
Data Source
AI summary
A semiconductor package includes a first die, a second die, an encapsulating material, and a redistribution structure. The second die is disposed over the first die and includes a plurality of bonding pads bonded to the first die, a plurality of through vias extending through a substrate of the second die and a plurality of alignment marks, wherein a pitch between adjacent two of the plurality of alignment marks is different from a pitch between adjacent two of the plurality of through vias. The encapsulating material is disposed over the first die and at least laterally encapsulating the second die. The redistribution structure is disposed over the second die and the encapsulating material and electrically connected to the plurality of through vias.