Stacked Die Assembly Using Pillar Redistribution for Thinner Packaging
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Solution Overview
Problem
Conventional semiconductor manufacturing processes are time-consuming and costly, resulting in unreliable connections and suboptimal interconnection structures in semiconductor packages, which are also associated with increased package thickness and complexity.
Innovation Solution
A semiconductor device with a stacked die structure is manufactured using a method that involves forming metal pillars on substrates, coupling semiconductor dies, and encapsulating them with material to reduce thickness and facilitate stacking, while ensuring reliable electrical connections through pillar redistribution structures and adhesion members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional semiconductor manufacturing processes are used, then manufacturing experience and traditional methods are applied, but the processes are too time-consuming and costly
Solution Approach 1:
The patent segments the semiconductor manufacturing process into distinct modules: forming metal pillars on first substrate, coupling first semiconductor die to first substrate, forming metal pillars on first semiconductor die, coupling second semiconductor die to first semiconductor die. This segmentation allows parallel processing and reduces overall manufacturing time while maintaining connection reliability.
Solution Approach 2:
The patent applies preliminary action by forming metal pillars on substrates before coupling semiconductor dies. The metal pillars are prepared in advance on the first substrate, and additional metal pillars are formed on the first semiconductor die before the second die is coupled, ensuring reliable interconnections are established before final assembly.
2Reliability
If conventional packaging structures are used, then traditional interconnection structures are formed, but the connections are unreliable and interconnection structures have suboptimal dimensions
Solution Approach 1:
The patent changes the dimensional parameters of interconnection structures by forming metal pillars with optimized heights and diameters. The metal pillars on the first substrate and first semiconductor die are formed with specific dimensions that improve electrical connection reliability while maintaining optimal signal integrity and reducing resistance.
3Device complexity
If traditional manufacturing methods are used, then conventional package structures are produced, but the package thickness is increased and complexity is increased
Solution Approach 1:
The patent merges multiple manufacturing steps into an integrated process where metal pillars are formed on both the first substrate and the first semiconductor die within the same processing sequence. The coupling of the second semiconductor die to the first semiconductor die is performed in the same manufacturing run, reducing the number of separate packaging operations and reducing overall package thickness.
Data Source
AI summary
Various aspects of this disclosure provide a semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a stacked die structure and a method of manufacturing thereof.