Stacked Die Pressure Sensor Package With Offset Logic Die
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Solution Overview
Problem
Conventional pressure sensor packages face challenges in reducing footprint and ensuring unobstructed pressure sensor ports due to lateral placement of pressure and logic dies, which complicates board mounting and increases the package footprint.
Innovation Solution
The pressure sensor and logic dies are stacked with the logic die laterally offset from the pressure sensor's electrical contacts, connected via electrical conductors, and encapsulated with molding compound that maintains an open passage to the pressure sensor port, allowing for external electrical contacts on the same side as the port.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If pressure sensor and logic dies are disposed laterally adjacent on a substrate, then electrical connections can be made by wire bonding, but the footprint of the pressure sensor package substantially increases
Solution Approach 1:
The patent transitions from a two-dimensional lateral arrangement of dies to a three-dimensional stacked arrangement. The logic die is positioned above the pressure sensor die, utilizing the vertical dimension to reduce the horizontal footprint while maintaining electrical connectivity through wire bonds that extend vertically between layers.
2Ease of operation
If external electrical connections are bent toward the same side as the pressure sensor port, then board mounting is possible, but the pressure sensor port becomes obstructed
Solution Approach 1:
The patent creates an asymmetric configuration where the logic die is offset laterally relative to the pressure sensor die and its port. This asymmetric positioning allows external electrical connections to be routed away from the port side, enabling board mounting without obstructing the pressure sensor port.
3Area of stationary object
If logic die is stacked on pressure sensor with lateral offset, then package footprint is reduced and port remains unobstructed, but electrical connection complexity increases
Solution Approach 1:
The patent introduces wire bonds as intermediary elements that facilitate electrical connections between the laterally offset logic die and pressure sensor die. These wire bonds act as flexible connectors that can span the lateral offset distance, maintaining electrical connectivity despite the complex spatial arrangement.
Data Source
AI summary
A pressure sensor package includes a pressure sensor having a first side with a pressure sensor port, a second side opposite the first side, and electrical contacts. A logic die stacked on the pressure sensor has a first side attached to the second side of the pressure sensor and a second side opposite the first side with electrical contacts. The logic die is laterally offset from the electrical contacts of the pressure sensor and operable to process signals from the pressure sensor. Electrical conductors connect the electrical contacts of the pressure sensor to the electrical contacts of the logic die. Molding compound encapsulates the pressure sensor, the logic die and the electrical conductors, and has an opening defining an open passage to the pressure sensor port. External electrical contacts are provided at a side of the pressure sensor package.