Stacked Semiconductor Die Repair Storage for Shared Redundancy
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Solution Overview
Problem
The integration of semiconductor devices is compromised by the need to store repair information for each semiconductor die, which occupies valuable space and reduces efficiency when provided within the dies.
Innovation Solution
Storing repair information in a centralized repair storage for multiple semiconductor dies, allowing efficient sharing and utilization of this information across stacked semiconductor dies, thereby increasing integration and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If repair information is stored within each semiconductor die, then each die can perform independent repair operations, but the integration is compromised and valuable space is occupied
Solution Approach 1:
The patent merges the repair information storage function from individual semiconductor dies to a centralized repair storage unit. This consolidation allows multiple dies to share repair information without each die maintaining its own storage, thereby improving integration while preserving repair capabilities through shared access to repair data.
Solution Approach 2:
The centralized repair storage serves multiple semiconductor dies simultaneously, providing universal access to repair information across the entire device. This multi-functional approach allows any die to perform repair operations using shared repair data, eliminating the need for dedicated storage in each die.
2Ease of repair
If repair information is stored within each semiconductor die, then repair operations can be performed locally, but space efficiency is reduced
Solution Approach 1:
The patent consolidates duplicate repair information storage across multiple dies into a single centralized repair storage unit. This merging eliminates redundant storage space while maintaining local repair capability through shared access to the same repair information, significantly improving space efficiency.
Solution Approach 2:
Instead of storing repair information physically in each die, the system creates logical copies of the repair data in repair registers within each die by reading from the centralized repair storage. This allows multiple dies to access the same repair information without duplicating the actual storage capacity in each die.
3Reliability
If redundant storage is provided in each semiconductor die, then repair operations are robust, but integration and efficiency are reduced
Solution Approach 1:
The patent merges redundant storage functionality into a single centralized repair storage unit that serves all semiconductor dies. This eliminates the need for each die to maintain its own redundant storage, improving device efficiency while preserving repair robustness through shared access to repair information across all dies.
Data Source
AI summary
A semiconductor device includes a first semiconductor die including a plurality of first memory blocks and a plurality of first repair registers respectively connected to the plurality of first memory block, and a second semiconductor die including a plurality of second memory blocks, a plurality of second repair registers respectively connected to the plurality of second memory blocks, and a repair storage in which first pieces of repair information for the plurality of first memory blocks and second pieces of repair information for the plurality of second repair blocks are stored. The first semiconductor die and the second semiconductor die are stacked on each other, and when the semiconductor device is powered on, the plurality of first repair registers receive and store the first pieces of repair information from the repair storage, and the plurality of first memory blocks perform a repair operation based on the first pieces of repair information stored in the plurality of first repair registers.