Stacked Die Solid-State Contactor Thermal Management
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Solution Overview
Problem
Conventional switching devices in power distribution systems face issues such as wear and arcing in mechanical contactors and thermal management challenges in logic-controlled relays, which limit their reliability and applicability, especially in harsh environments like aircraft power distribution systems.
Innovation Solution
A stacked die solid-state contactor design is introduced, featuring a housing with split bus plates and end connectors that form a monolithic structure, allowing for efficient heat transfer and reduced susceptibility to wear and arcing, using direct-write interconnects and insulating materials to enhance electrical and thermal connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical contactors are used for switching, then current flow control is achieved through physical movement, but wear and arcing occur reducing reliability
Solution Approach 1:
The patent replaces the mechanical moving contactor structure with a solid-state stacked die configuration. The mechanical switching action is substituted with electronic switching through multiple semiconductor dies stacked vertically, eliminating physical contact and movement. This substitution removes the sources of wear and arcing while maintaining the current flow control function.
Solution Approach 2:
The patent transitions from a planar mechanical contactor design to a three-dimensional stacked die architecture. By stacking semiconductor dies vertically in the Z-dimension, the design achieves higher current handling capability and reduced parasitic capacitance while eliminating mechanical wear issues. The vertical stacking arrangement optimizes thermal pathways and electrical connectivity.
2Reliability
If logic controlled relays or transistors are used for switching, then wear and arcing are reduced, but heat generation increases creating thermal management challenges
Solution Approach 1:
The patent divides the thermal management function across multiple segmented pathways. Each semiconductor die is attached to its own bus plate with dedicated thermal vias and heat dissipation paths. The stacked configuration creates multiple parallel thermal channels that distribute heat load, preventing localized overheating and improving overall thermal management efficiency.
Solution Approach 2:
The stacked die structure provides self-cooling through direct thermal attachment to heat sinks or cooling plates. The vertical stacking arrangement allows heat to conduct directly from the active die regions through the bus plates to external cooling surfaces, creating an inherent thermal management system that reduces reliance on external active cooling mechanisms.
3Temperature
If conventional planar bus bars are used for thermal management, then heat dissipation is achieved, but device size increases
Solution Approach 1:
The patent employs vertical stacking of semiconductor dies and bus plates in the Z-dimension to achieve high current density and effective thermal management within a compact footprint. By utilizing the third dimension for both electrical connectivity and thermal pathways, the design eliminates the need for large planar bus bars while maintaining heat dissipation capability. The stacked architecture achieves superior power density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable and efficient current switching with improved thermal management, enabling interchangeability with conventional mechanical contactor assemblies and reducing parasitic capacitance for enhanced performance in power distribution systems.
Implementation Method 1
The lead can have a shape conforming to a shape of a least of the mechanical contactor assembly such that heat from the solid-state contactor is conducted from the housing interior to the external environment
Implementation Method 2
The first and second layers can be joined or bonded to one another and the respective bus plate surfaces by ultrasonic welds
Data Source
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AI summary
A solid-state contactor (100) includes a housing (104), a lead (110, 120), a bus plate (140, 142, 144, 146; 240), and an end connector (150, 160). The lead extends through the housing and into an interior (106) of the housing. The bus plate is disposed within the housing interior and mounts a die (170; 270) which is electrically connected to the lead through the bus plate. The end connector extends between the bus plate and the lead, attaching to the bus plate at an angle for coupling a plurality of bus plates with die to the lead in a stacked arrangement.