Stacked Die Assembly Support Members for Wirebonding Stability
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Solution Overview
Problem
Vertically stacked semiconductor dies with different sizes or footprints face challenges in wirebonding and tilting issues due to uneven encapsulation and complex manufacturing processes, particularly when a memory controller die is smaller than memory dies, complicating the stacking and increasing manufacturing costs.
Innovation Solution
The implementation of support members made from semiconductor materials with a similar coefficient of thermal expansion to the dies, which are attached to the package substrate and allow for direct stacking of memory dies without initial encapsulation of the controller die, reducing thermal stresses and eliminating high-temperature molding steps, thereby simplifying manufacturing and preventing die tilt.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If vertically stacked semiconductor dies with different sizes are used to increase density, then die density is improved, but wirebonding difficulty increases and die tilting occurs
Solution Approach 1:
The patent introduces an intermediary substrate that acts as a mediator between the controller die and memory dies. This substrate provides a common mounting platform that enables proper alignment and wirebonding access, resolving the wirebonding difficulty caused by stacking dies of different sizes vertically without the intermediary.
2Quantity of substance
If vertically stacked semiconductor dies with different sizes are used to increase density, then die density is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the manufacturing process into distinct stages: first mounting the controller die to the substrate, then separately mounting memory dies to the same substrate. This segmentation simplifies manufacturing by avoiding the complexity of directly stacking differently-sized dies, allowing each die type to be processed and positioned independently on the common substrate.
3Reliability
If initial encapsulation of the controller die is performed before stacking, then die protection is improved, but thermal stresses increase and high-temperature molding is required
Solution Approach 1:
The patent performs preliminary mounting of all dies to the substrate before performing encapsulation. This preliminary arrangement allows the encapsulant to uniformly cover all dies simultaneously, distributing thermal stresses evenly during the molding process and eliminating the need for high-temperature steps that would be required if encapsulation were performed on already-stacked dies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances manufacturing efficiency by eliminating complex encapsulation steps, reduces thermal stresses, and prevents die tilting, facilitating easier wirebonding and improving the stability of the die stack within the package.
Implementation Method 1
support members made from semiconductor materials with a similar coefficient of thermal expansion to the dies, which are attached to the package substrate and allow for direct stacking of memory dies without initial encapsulation of the controller die, reducing thermal stresses
Data Source
AI summary
Stacked semiconductor die assemblies with die support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a support member attached to the package substrate. The support member can be separated from the first semiconductor die, and a second semiconductor die can have one region coupled to the support member and another region coupled to the first semiconductor die.