Thermally Conductive Die Casing for Stacked Chip Heat Dissipation
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Solution Overview
Problem
Vertically stacked semiconductor die assemblies face challenges in heat dissipation, leading to increased operating temperatures and reduced performance due to inefficient thermal management.
Innovation Solution
A thermally conductive casing with an interposer attached to the die stack, utilizing thermal interface materials and through-substrate interconnects to facilitate heat transfer and reduce temperature, while also optimizing the placement of logic and memory dies to direct heat away from the memory dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor dies are vertically stacked to increase processing power without increasing package footprint, then the functional capacity and processing power are improved, but heat dissipation becomes difficult and operating temperatures increase
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional thermal management by stacking dies vertically and implementing thermal vias that conduct heat through the substrate thickness dimension. The thermal vias extend vertically through the substrate, creating a new thermal conduction path in the Z-dimension, which allows heat to be dissipated from internal die layers without increasing the package footprint.
Solution Approach 2:
The patent introduces thermal vias as intermediary structures that facilitate heat transfer between the stacked dies and the external environment. These vias act as thermal conduits, mediating the heat flow from the heat-generating dies through the substrate to external heat sinks or dissipation paths, thereby resolving the thermal management challenge in stacked configurations.
2Area of stationary object
If vertically stacked packages are used to fit space constraints, then the package footprint is reduced, but heat generated is difficult to dissipate
Solution Approach 1:
The patent addresses the heat dissipation challenge in compact packages by exploiting the vertical dimension. Thermal vias are formed extending through the substrate thickness, creating thermal conduction paths in the vertical dimension rather than relying solely on horizontal heat spreading. This dimensional transition enables effective heat removal from stacked dies without increasing the package footprint.
Solution Approach 2:
The patent segments the thermal management function into multiple independent thermal vias distributed throughout the substrate. Rather than relying on a single heat dissipation path, multiple thermal vias are created at different locations, each providing an independent thermal conduction channel. This segmentation of the thermal management function improves overall heat dissipation efficiency while maintaining the compact package footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively manages heat dissipation, allowing the semiconductor dies to operate below maximum operating temperatures, thereby maintaining faster processing speeds and higher data throughput.
Implementation Method 1
a thermally conductive casing (110) attached to an interposer (120)... utilizing thermal interface materials and through-substrate interconnects to facilitate heat transfer
Data Source
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AI summary
Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a stack of semiconductor dies and a thermally conductive casing at least partially enclosing the stack of semiconductor dies within an enclosure. A package substrate carries the thermally conductive casing, and an interposer is disposed between the thermally conductive casing and the stack of semiconductor dies. A peripheral portion of the interposer extends laterally beyond the stack of semiconductor dies and is coupled to a plurality of conductive members interposed between the peripheral portion and the package substrate.