3D Stacked Die Layout for Thermal Hotspot Management
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Solution Overview
Problem
Stacked semiconductor chip devices face challenges in providing adequate electrical interfaces, thermal management, and testing, particularly due to the varying power densities and heat dissipation requirements across different logic blocks within the chips.
Innovation Solution
The semiconductor chip device incorporates a floor plan with high and low heat producing areas, where the chip stack is mounted on the low heat producing area and dummy components are used on the high heat producing areas to facilitate heat transfer, utilizing molding material encapsulation and interconnects for electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If stacked dice arrangement is used to increase integration density, then device functionality and compactness are improved, but thermal management becomes more difficult due to heat accumulation in confined space
Solution Approach 1:
The patent segments the stacked dice arrangement into functionally distinct layers: a base die for high-performance computing, memory dies for storage, and I/O dies for communication. Each layer has optimized thermal characteristics, with the base die positioned to maximize heat dissipation to the substrate while upper layers handle different thermal loads.
Solution Approach 2:
The patent applies local quality by positioning high heat-generating logic blocks in specific regions of the base die with enhanced thermal pathways, while placing low heat-generating memory blocks in regions with standard thermal management. This localized thermal optimization allows efficient heat dissipation from critical areas without compromising overall device compactness.
2Adaptability or versatility
If high heat producing logic blocks are interspersed with low heat producing blocks on the same chip, then functional integration is improved, but thermal management complexity increases due to varying power densities
Solution Approach 1:
The patent segments the chip into distinct high heat-producing logic blocks and low heat-producing memory blocks, with dedicated thermal pathways for each segment. This segmentation maintains functional integration while simplifying thermal management by treating different thermal zones independently.
Solution Approach 2:
The patent introduces thermal intermediary structures, such as thermal vias and heat spreaders, that mediate between high and low heat-producing blocks. These intermediaries facilitate heat transfer from logic blocks to heat sinks while isolating memory blocks from excessive thermal loads, thereby managing thermal complexity without sacrificing functional integration.
3Reliability
If conventional packaging with lid is used for heat transfer, then protective coverage and basic heat dissipation are achieved, but inadequate thermal management occurs for high power density stacked devices
Solution Approach 1:
The patent segments the packaging structure into multiple functional components: a protective lid for mechanical coverage, enhanced heat sinks with increased surface area, and dedicated thermal pathways between different die layers. This segmentation enables the packaging to simultaneously provide protective coverage and high-efficiency thermal management for stacked devices.
Solution Approach 2:
The patent transitions from conventional two-dimensional heat dissipation to three-dimensional thermal management by implementing vertical heat pathways through the stacked die structure. Thermal vias and heat spreaders conduct heat in the vertical dimension, significantly improving heat dissipation efficiency while maintaining protective packaging coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively manages thermal dissipation and electrical connectivity, allowing for efficient operation and testing of stacked semiconductor chips while minimizing unnecessary processing of defective parts.
Implementation Method 1
heat transfer means positioned on the high heat producing area of the second semiconductor chip
Data Source
AI summary
Various semiconductor chip devices with stacked chips are disclosed. In one aspect, a semiconductor chip device is provided. The semiconductor chip device includes a first semiconductor chip that has a floor plan with a high heat producing area and a low heat producing area. At least one second semiconductor chip is stacked on the low heat producing area. The semiconductor chip device also includes means for transferring heat from the high heat producing area.