Stacked Semiconductor Die Package With Localized Thermal Support
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Solution Overview
Problem
The challenges of thermal management and structural integrity in semiconductor die packages arise due to the different attributes of IC dies, such as varying thermal requirements and expansion rates, leading to reduced operational lifetime and potential failure.
Innovation Solution
Incorporating non-active dies with tailored materials and configurations to manage thermal dissipation and structural stability, such as using non-active dies with varying thermal conductivity and stiffness to match the requirements of specific IC die regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If IC dies with different thermal requirements are arranged in a semiconductor die package, then functionality is improved, but thermal management becomes difficult leading to reduced operational lifetime
Solution Approach 1:
The patent segments the semiconductor die package into multiple regions, each with non-active dies tailored to specific thermal management requirements. Different regions of the active IC die are matched with non-active dies having appropriate thermal conductivity values, creating localized thermal zones that address the diverse thermal needs of different functional regions.
Solution Approach 2:
The patent applies local quality by varying the thermal conductivity of non-active dies across different regions of the semiconductor package. Each region's non-active die is specifically configured with thermal properties matched to the underlying active circuitry, enabling localized thermal optimization rather than uniform thermal management across the entire package.
2Stability of the object's composition
If non-active dies with varying thermal conductivity are used, then thermal stability is improved, but device complexity increases
Solution Approach 1:
The semiconductor die package is segmented into multiple regions, each containing non-active dies with specific thermal conductivity values. This segmentation allows thermal stability to be optimized locally in each region without requiring complex active thermal management systems across the entire device.
Solution Approach 2:
The patent uses non-active dies that are simpler and less expensive than fully functional active IC dies. These non-active dies serve primarily as thermal management elements and structural fillers, providing thermal stability without the complexity and cost of complete functional circuits.
3Volume of moving object
If IC dies are vertically arranged using 3D packaging, then space utilization is improved, but thermal management and structural integrity become more challenging
Solution Approach 1:
The non-active dies serve multiple functions simultaneously: they provide thermal management for underlying active regions, maintain structural integrity in the 3D stacked configuration, and fill unused space in the semiconductor package. This multi-functionality addresses several challenges of 3D packaging with a single element type.
Solution Approach 2:
The patent varies physical parameters of non-active dies, such as thermal conductivity and stiffness, to match the requirements of different regions in the 3D stacked structure. By adjusting these parameters, the non-active dies can effectively manage heat dissipation and maintain structural integrity throughout the vertical arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal stability and structural integrity, increasing the operational lifetime and reliability of semiconductor die packages by optimizing thermal management and structural support.
Implementation Method 1
non-active dies with varying thermal conductivity... to manage thermal dissipation
Implementation Method 2
non-active dies with varying thermal conductivity and stiffness to match the requirements of specific IC die regions
Data Source
AI summary
A first integrated circuit (IC) die is directly bonded together with a second IC die in a vertical arrangement in a semiconductor die package. The smaller physical size of the first IC die enables a plurality of non-active dies to be placed over the second IC die in areas not occupied by the first IC die. Including a plurality of non-active dies enables the non-active dies to be customized for the different attributes of different areas of the second IC die, including different thermal profiles of the different areas of the second IC die. In this way, including a plurality of non-active dies in the semiconductor die package may increase the thermal stability of the semiconductor die package, which may prolong the operational lifetime of the IC dies, may reduce the likelihood of failure of the IC dies, and/or may increase the overall reliability of the semiconductor die package.