Stacked Semiconductor Die Assembly With Support Members to Prevent Tilting
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Solution Overview
Problem
Vertically stacked semiconductor dies with different sizes or footprints face challenges in wirebonding and tilting issues due to uneven encapsulation of the controller die, complicating manufacturing and increasing costs.
Innovation Solution
The use of spacer support members, formed from semiconductor materials with a similar coefficient of thermal expansion as the memory dies, which are attached to the package substrate and provide a stable mounting surface for the memory dies, eliminating the need for early encapsulation of the controller die and reducing thermal cycling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If vertically stacked semiconductor dies with different sizes are used to increase density, then die density is improved, but wirebonding difficulty increases and die tilting occurs
Solution Approach 1:
A support member with a first surface and second surface is introduced as an intermediary component. The first surface supports the controller die while the second surface supports the memory dies. This mediator structure enables stable stacking of differently sized dies by providing appropriate support surfaces for each die type, resolving the wirebonding difficulty and tilting issues caused by direct stacking of mismatched dies.
2Stability of the object's composition
If controller die is encapsulated early in the manufacturing process, then structural stability is improved, but manufacturing complexity and thermal cycling increase
Solution Approach 1:
The support member is attached to the package substrate before the controller die is mounted and before encapsulation occurs. This preliminary action provides structural stability early in the manufacturing process without requiring early encapsulation of the controller die. The support member serves as a stable foundation that enables subsequent assembly steps without adding manufacturing complexity or thermal cycling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies manufacturing by eliminating the need for high-temperature molding, reduces thermal stresses, and prevents die tilting, making wirebonding more straightforward and cost-effective.
Implementation Method 1
spacer support members, formed from semiconductor materials with a similar coefficient of thermal expansion as the memory dies
Data Source
AI summary
Stacked semiconductor die assemblies with support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a plurality of support members also attached to the package substrate. The plurality of support members can include a first support member and a second support member disposed at opposite sides of the first semiconductor die, and a second semiconductor die can be coupled to the support members such that at least a portion of the second semiconductor die is over the first semiconductor die.