Stacked Die Bandwidth via Dedicated TSV Buses
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Solution Overview
Problem
The existing stacked die package structures face a trade-off between data bandwidth and the number of through-substrate vias (TSVs), where increasing TSVs requires larger die sizes, limiting reusability and data bandwidth, especially as demand for higher data storage capacity and bandwidth increases.
Innovation Solution
The solution involves a package structure with identical die carriers and device dies, where each die carrier includes TSVs forming dedicated data buses and address/control lines, and enablement signal generation circuits to control transmission gates, allowing multiple die carriers to be stacked without increasing die size, thereby enhancing data bandwidth without the need for customization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of TSVs is increased to meet higher data storage capacity and bandwidth requirements, then data bandwidth is improved, but die size must be increased and the stacked dies become customized for a specific package structure, reducing reusability
Solution Approach 1:
The patent segments the data transmission function by dedicating specific data buses to specific device dies through enablement signals. This segmentation allows each die carrier to handle multiple dies with customized bandwidth allocation without requiring physical customization of each die, thus increasing data bandwidth while maintaining reusability.
Solution Approach 2:
The patent introduces dynamic control through enablement signals that can be selectively activated to dedicate specific data buses to specific device dies. This dynamic allocation allows the same die carrier design to adapt to different bandwidth requirements and die configurations, improving both data bandwidth and reusability.
2Productivity
If the number of TSVs is increased to improve data bandwidth, then data storage capacity and bandwidth are enhanced, but the die size must be increased, which is not desirable
Solution Approach 1:
The patent changes the parameter of data bus allocation from static to dynamic through enablement signals. This allows the same physical data buses to be dynamically assigned to different device dies based on bandwidth requirements, enhancing data bandwidth without increasing die size or TSV count.
3Productivity
If dedicated data buses are assigned to each device die through enablement signals, then data bandwidth is increased and simultaneous read/write operations are enabled, but device complexity increases due to enablement signal generation circuits
Solution Approach 1:
The enablement signal generation circuits are designed with multi-functionality, serving both to dedicate data buses to specific dies and to enable simultaneous read/write operations. This universal approach increases data bandwidth while minimizing the additional complexity by consolidating multiple functions into single circuit elements.
Data Source
AI summary
A package structure includes a plurality of die carriers identical to each other. The respective features in each of the plurality of die carriers vertically overlap corresponding features in other ones of the plurality of die carriers. Each of the plurality of die carriers includes a plurality of through-substrate vias (TSVs) including a plurality of data buses. The plurality of die carriers is stacked and electrically connected to each other through the plurality of TSVs. The package structure further includes a plurality of device dies. Each of the plurality of device dies is bonded to one of the plurality of die carriers. Each of the plurality of data buses is configured to dedicate to data transmission of one of the plurality of device dies.