Stacked Dies Via Interconnect Redundancy and Interposer Alignment
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Solution Overview
Problem
Conventional 3D integrated circuit (IC) technology discards defective dies due to non-functional electrical connections, leading to reduced yield in stacked configurations, as only non-defective dies can be used for proper functionality.
Innovation Solution
Incorporating redundant via interconnects in partially defective dies and using interposers to align and electrically connect functional and redundant via interconnects across different dies, allowing for the utilization of previously discarded defective dies in stacked configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional D2D bonding is used with strict alignment requirements, then electrical connection reliability is improved, but yield decreases due to discarding defective dies
Solution Approach 1:
The patent changes the alignment parameter from strict direct alignment to flexible alignment through multiple possible orientations (0 degrees, 45 degrees, 90 degrees, 135 degrees). This allows defective dies to be realigned with interposers to match functional vias, maintaining electrical connection reliability while increasing yield by utilizing previously discarded defective dies.
Solution Approach 2:
The patent introduces interposers as intermediary components between dies. These interposers contain conductive structures that can be oriented at various angles to bridge the alignment mismatch between defective die vias and functional vias, enabling electrical connection reliability to be maintained while accommodating defective dies that would otherwise be discarded.
2Productivity
If redundant via interconnects are added to compensate for defective vias, then yield is improved by utilizing defective dies, but device complexity increases
Solution Approach 1:
The patent segments the interconnection function across multiple components: the original die vias, the interposer conductive structures, and the redundant via interconnects. This segmentation allows the system to handle defective vias by routing connections through alternative paths via the interposer, increasing yield while managing complexity through modular functional distribution.
Solution Approach 2:
The interposer serves multiple functions: it provides alignment compensation for defective dies, creates electrical connections between mismatched vias, and enables the system to utilize both functional and defective dies. This multi-functionality increases yield while the added complexity is concentrated in the interposer rather than requiring complex modifications to each die.
Data Source
AI summary
The present disclosure generally relates to semiconductor structures and, more particularly, to stacked dies using one or more interposers and methods of manufacture. The structure includes: at least one die comprising a plurality of via interconnects, the plurality of via interconnects comprising at least one functional via interconnect, one defective via interconnect and one redundant functional via interconnect to compensate for the one defective via interconnect; and an interposer which includes interconnects that aligns to and electrically connects the at least one functional via interconnect and the redundant functional via interconnect of different dies when the interposer is oriented in a predetermined orientation.