Vertically Stacked Direct Die Cooled Power Packages
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Solution Overview
Problem
Existing liquid cooling methods for high power semiconductor devices are inefficient in managing high waste heat and ambient temperatures, particularly in direct die cooling where the heat transfer is not effectively distributed across semiconductor chips in stacked configurations.
Innovation Solution
A vertically stacked liquid cooled power electronic circuit is designed with direct die cooling, where each semiconductor power device package has both electrical and coolant interfacing, allowing for efficient heat transfer through vertically aligned fluid passages and re-orientable package configurations to maintain coolant flow while adjusting electrical interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If direct die cooling is implemented on a modular basis with stacked packages, then heat transfer efficiency is improved, but device complexity increases due to vertical stacking and interconnection requirements
Solution Approach 1:
The patent combines multiple cooling channels and electrical interconnects into a single integrated stacked package structure. The fluid distribution plate integrates multiple coolant channels that distribute cooling fluid to multiple semiconductor dies simultaneously, while electrical interconnects between stacked packages are formed through the same structural assembly process, merging thermal management and electrical connection functions into one unified device architecture.
Solution Approach 2:
The patent transitions from planar cooling arrangements to three-dimensional stacked packages. Multiple semiconductor dies are stacked vertically with cooling channels arranged in multiple layers and orientations (horizontal, vertical, inclined) to match the three-dimensional heat generation patterns. This dimensional transition allows heat to be extracted from multiple surfaces and depths of the stacked structure, significantly improving heat transfer efficiency while managing the increased complexity through systematic spatial organization.
2Volume of moving object
If multiple semiconductor packages are vertically stacked for compact configuration, then space utilization is improved, but manufacturing precision requirements increase due to alignment of fluid passages and electrical interconnects
Solution Approach 1:
The patent incorporates alignment features and registration structures during the preliminary stages of package fabrication. The fluid distribution plate includes precisely positioned inlet and outlet ports that align with corresponding channels in stacked packages. Electrical interconnect structures are pre-formed with alignment tolerances built into the manufacturing process, allowing packages to be stacked and connected with reduced precision requirements during final assembly.
Solution Approach 2:
The patent introduces intermediate structural elements such as fluid distribution plates and alignment fixtures that mediate between individual packages during assembly. These intermediaries provide mechanical support, fluid distribution, and alignment references that reduce the direct precision requirements between stacked packages. The fluid distribution plate acts as an intermediary that distributes coolant to multiple dies through pre-aligned channels, while also serving as a mechanical interface that facilitates precise stacking.
3Loss of energy
If coolant channels are integrated directly into semiconductor dies, then heat removal effectiveness is improved, but ease of manufacture decreases due to additional processing steps
Solution Approach 1:
The patent segments the cooling function into separate modular components: semiconductor dies with integrated cooling channels, fluid distribution plates with inlet/outlet ports, and stacked package assemblies. This segmentation allows each component to be manufactured independently using optimized processes for that specific function, then assembled into the complete system. The segmentation reduces manufacturing complexity by avoiding the need to integrate all cooling features into a single monolithic structure.
Solution Approach 2:
The patent designs the fluid distribution plate to serve multiple functions: distributing coolant to multiple stacked dies, providing mechanical support for the stacked structure, facilitating alignment during assembly, and enabling fluid inlet/outlet connections. This multi-functionality reduces the total number of components needed and simplifies the manufacturing process by consolidating several functions into a single universal component rather than requiring separate specialized parts for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat transfer efficiency and flexibility in circuit configurations, enabling effective management of high waste heat and ambient temperatures in power electronic circuits, improving performance and reliability.
Implementation Method 1
The heat transfer can be significantly improved by bringing the liquid coolant directly into contact with the semiconductor chip (die)... the circulating fluid flows through the channels to remove heat from the chip
Implementation Method 2
liquid coolant is circulated... flows through the channels to remove heat from the chip
Data Source
Figure 1
Figure 2A~5A
Figure 4A~4E
AI summary
A plurality of direct die cooled semiconductor power device packages (60/60') arc vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages (60/60') arc individually identical, and selectively oriented prior to stacking in order to form the desired circuit connections and laterally stagger the package leads (36, 40, 42).