Stacked-Disk Heating-Cooling Module With Integrated Expansion Valve
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Solution Overview
Problem
Existing heating-cooling modules in stacked disk designs are complex, requiring extensive installation space and numerous connections, which increase assembly effort and susceptibility to errors, and lack internal heat exchangers or chillers.
Innovation Solution
A compact heating-cooling module with a stacked disk design featuring a condenser region, evaporator region, and fluid distribution region, where the condenser and evaporator areas are arranged next to each other, with integrated thermostatic expansion valves and optional internal heat exchangers, collectors, and subcoolers, and fluid distribution areas that allow for efficient coolant and refrigerant flow paths, reducing the need for external connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional components are added to the refrigerant circuit to enable heating and cooling of batteries, then the functionality is improved, but the circuit complexity and susceptibility to errors increase
Solution Approach 1:
The patent combines the evaporator and condenser into a single stacked disk assembly, integrating multiple heat exchanger functions into one compact unit. This merging eliminates the need for separate components and reduces the number of connections required, thereby maintaining enhanced functionality while reducing circuit complexity and error susceptibility.
Solution Approach 2:
The stacked disk assembly serves multiple functions simultaneously - it acts as both an evaporator and a condenser, and can be configured for different cooling modes (battery cooling, interior cooling). This multi-functionality allows the system to achieve heating and cooling capabilities without adding separate dedicated components for each function.
2Adaptability or versatility
If a chiller and condenser are used to provide warm and cold water, then the heating and cooling capability is improved, but the number of components and installation space requirements increase
Solution Approach 1:
The stacked disk design nests multiple flow channels and heat exchanger surfaces within a compact vertical arrangement. The disks are stacked one on top of another with flow channels between them, creating a space-efficient structure that provides both heating and cooling capabilities in a minimal installation footprint.
Solution Approach 2:
The patent transitions from a planar arrangement of heat exchanger components to a three-dimensional stacked configuration. By utilizing the vertical dimension through stacked disks, the system achieves comprehensive heating and cooling functionality without proportionally increasing the horizontal installation space.
3Stability of the object's composition
If the condenser and evaporator are arranged at a distance from each other and connected via different pipelines, then the functional separation is improved, but the number of connecting lines and assembly effort increase
Solution Approach 1:
The condenser and evaporator are merged into a single stacked disk assembly where both functions coexist in close proximity. The different flow channels for refrigerant and coolant are integrated within the same structural unit, eliminating the need for extensive external piping while maintaining functional separation through dedicated internal flow paths.
4Ease of operation
If switching valves are added to control and regulate refrigerant circuits, then the control capability is improved, but the installation effort and error susceptibility increase
Solution Approach 1:
The stacked disk assembly is designed with integrated flow distribution that allows refrigerant and coolant to be directed to appropriate channels through the stack configuration itself, rather than requiring external switching valves. The modular design enables control through the arrangement and connection of stack units rather than through additional active control components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, easy-to-produce heating-cooling module with reduced connections, improved assembly efficiency, and enhanced heat transfer capabilities, increasing the module's overall efficiency and reducing maintenance complexity.
Implementation Method 1
having a thermostatic expansion valve through which refrigerant can flow
Implementation Method 2
thermostatic expansion valve through which refrigerant can flow
Implementation Method 3
condenser region having a first flow path through which a refrigerant can flow, and having a second flow path, through which a coolant can flow
Implementation Method 4
condenser region having a first flow path through which a refrigerant can flow
Implementation Method 5
evaporator area has a third flow path through which a refrigerant can flow, and a fourth flow path through which a coolant can flow
Implementation Method 6
evaporator area has a third flow path through which a refrigerant can flow
Implementation Method 7
flow paths being formed by a plurality of flow channels which are between the individual ones Disc elements
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates to a heating/cooling module (1) of stacked disc design, having a condenser region (2), having an evaporator region (3) and having at least one fluid distribution region (4), wherein the condenser region (2) has a first flow section (12) which can be flowed through by a refrigerant and a second flow section (13) which can be flowed through by a coolant, and the evaporator region (3) has a third flow section (12) which can be flowed through by a refrigerant and a fourth flow section (14) which can be flowed through by a coolant, wherein the flow sections (12, 13, 14) are formed by a plurality of flow ducts which are configured between the individual disc elements which form the heating/cooling module (1), wherein a first fluid inlet (6) and a first fluid outlet (7) are provided, via which the condenser region (2) can be flowed through with a coolant, and a second inlet (8) and a second outlet (9) are provided, via which the evaporator region (3) can be flowed through with a coolant, and a third inlet (10) and a third outlet (11) are provided, via which the heating/cooling module (1) can be flowed through with a refrigerant, wherein the at least one fluid distribution region (4) is arranged between the condenser region (2) and the evaporator region (3) and has a thermostatic expansion valve (5) which can be flowed through by refrigerant.