Stacked Display Circuit Layering for Signal Isolation

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Solution Overview

Problem

Conventional display devices suffer from conductive noise due to signal interference, as digital and analog signals are transmitted on the same layer, leading to interference between signal lines and power supply lines.

Innovation Solution

A stacked structure is implemented with separate layers for digital signal transmission, analog signal transmission, power supply voltage transmission, and a ground layer, with insulating layers in between to prevent electrical conduction and isolate these signals, using a flexible or printed circuit board configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If digital and analog signals are transmitted on the same layer, then device complexity is reduced, but conductive noise due to signal interference increases

Engineering Contradiction:
Improvestacked structure complexityVSAvoidconductive noise
Core Design Contradiction:
Device complexityVSObject-generated harmful factors

Solution Approach 1:

The patent segments the signal transmission by creating separate layers for digital signals and analog signals. The digital signal transmission layer and analog signal transmission layer are physically separated into different stacked layers, preventing interference between digital and analog signals while maintaining manageable device complexity through organized layering.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from planar signal transmission to three-dimensional stacked layer transmission. By utilizing the vertical dimension to separate digital and analog signals into different layers, the patent eliminates interference that would occur in two-dimensional planar layouts while maintaining signal transmission efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If signal lines and power supply lines are not isolated, then manufacturing precision requirements are reduced, but signal interference occurs

Engineering Contradiction:
Improvelayer alignment precisionVSAvoidsignal interference
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent segments power supply transmission into a separate power supply transmission layer, distinct from the digital and analog signal transmission layers. This segmentation isolates power supply lines from signal lines, preventing signal interference while establishing clear manufacturing guidelines for layer formation and connection.

Inventive Principle:
Principle #1Segmentation

3Reliability

If insulating layers are added between signal layers, then signal isolation is improved, but device complexity increases

Engineering Contradiction:
Improvesignal isolation effectivenessVSAvoidnumber of layers
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent introduces insulating layers as intermediary elements between the digital signal transmission layer and analog signal transmission layer. These insulating layers act as mediators that provide electrical isolation and prevent signal interference, while the overall stacked structure maintains organizational simplicity through systematic layer arrangement.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS7502021B2Stacked structure display device
Publication Date: 2009.03.10 SAMSUNG DISPLAY CO LTD
  • US7502021B2 patent drawing
  • US7502021B2 patent drawing
  • US7502021B2 patent drawing

AI summary

A stacked structure of a display device is capable of preventing conductive noise due to signal interference by isolating analog and digital output stages and a ground stage onto different layers. A driving device of an organic light emitting display has a scan driver for applying a plurality of scan signals, a data driver for applying a plurality of data signals, and a controller for providing a gradation voltage to the data driver and a scan signal to the scan driver. The stacked structure includes a ground layer, an analog signal-transmission layer for transmitting an analog signal, a digital signal-transmission layer for transmitting a digital signal and a power supply transmission layer for transmitting a power supply voltage. Each of the layers is formed on a different layer. Further, the stacked structure further includes a first mounting layer at a front of the structure on which circuits are mounted and a second mounting layer at a rear thereof on which circuits are mounted. The stacked structure further includes insulating layers formed between the respective layers to insulate the layers.