Stacked ECU PCB Layout With Central Heatsink and Short B2B Links
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Solution Overview
Problem
Existing electronic controller units (ECUs) face challenges in mechanical integration due to increasing density and complexity, requiring improved approaches for adjustable and extensible configurations that also provide effective cooling and signal integrity.
Innovation Solution
The ECU design features a heatsink with upper and lower cooling plates and a fluid channel, thermally coupled to multiple printed circuit boards (PCBs) via thermally conducting pedestals, allowing for direct thermal coupling and efficient cooling, while also using a board-to-board connector for electrical and communicative connections between PCBs, enabling a compact, high-density, and scalable arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a single PCB is used in traditional ECU arrangements, then the structure is simple, but the component density and cooling efficiency are limited
Solution Approach 1:
The patent transitions from a single-plane PCB arrangement to a three-dimensional stacked configuration with multiple PCBs positioned above and below the heatsink. This vertical dimensionality change enables increased component density without proportionally increasing the footprint area, while the modular stacked structure manages the complexity through standardized interfaces and alignment features.
Solution Approach 2:
The patent implements a nested arrangement where multiple PCBs are stacked around a central heatsink structure. The first PCB is positioned above the heatsink, the second PCB below it, with the heatsink nested in the middle. This nested configuration maximizes space utilization and enables direct thermal coupling between components on both PCBs and the heatsink.
2Temperature
If PCBs are positioned far from the heatsink, then assembly is easier, but cooling efficiency decreases
Solution Approach 1:
The heatsink is designed with pre-formed thermal contact surfaces and mounting features that align with corresponding features on the PCBs. Thermal interface materials are pre-applied to the heatsink surfaces, and the PCBs are positioned in predetermined locations during assembly. This preliminary preparation ensures optimal thermal contact while simplifying the assembly process through self-alignment mechanisms.
3Reliability
If connectors are made longer to reach between PCBs, then connection is achieved, but signal integrity and bandwidth are reduced
Solution Approach 1:
The patent positions connectors and electrical components in three-dimensional space to minimize trace lengths on the PCBs. By stacking PCBs vertically with controlled spacing, the electrical connection paths are shortened compared to traditional planar arrangements. The connector locations are optimized in the vertical dimension to reduce signal propagation distance while maintaining necessary electrical isolation and signal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides enhanced cooling, maintains signal integrity, and allows for increased component density and flexibility in ECU design, enabling efficient heat transfer and reduced wiring lengths for high-bandwidth signals, while accommodating various PCB configurations and components.
Implementation Method 1
a fluid channel arranged between the cooling plates and configured to receive a cooling fluid, wherein the cooling fluid is circulated through the channel in proximity to said cooling plates
Implementation Method 2
configured for thermally coupling to components located on said PCBs, and is configured to provide a thermal coupling of components to a respective cooling plate
Implementation Method 3
the upper and lower cooling plates (540, 545) each comprise a plurality of thermally conducting pedestals (550) extending outwardly therefrom towards the PCBs (200, 300, 400) and components (210) located thereon, wherein each pedestal (550) is configured to provide a thermal coupling of a component (201) to a respective cooling plate
Data Source
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AI summary
The specification provides arrangements including an electronic controller unit, ECU, (100) comprising a heatsink (500), a first printed circuit board, PCB; (200), and a second printed circuit board, PCB, (300). A plurality of components (210) are provided located on said PCBs. The heatsink (500) is arranged between the first and second PCBs (200, 300), and is thermally coupled to the components (210), to provide cooling. The heatsink (500) further comprises an aperture (507) extending through a body of the heatsink. The first PCB (200) is directly connected to the second PCB (300) by a board-to-board, B2B, connector configured to electrically and/or communicatively connect the PCBs located above and below the heatsink. The specification also provides arrangements of a heatsink provided for use within an ECU.