Stacked Through-Hole Electrode Layout for Compact Optical Sensors
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Solution Overview
Problem
The increasing size and manufacturing cost of optical sensing devices pose challenges as resolution improves, making them difficult to be widely used.
Innovation Solution
An electronic device design featuring a first substrate, a semiconductor element, a first inorganic layer, a first electrode, a second electrode, and a conductive element, with a through-hole and rounded corners, to enhance electrical connection and reduce manufacturing costs while maintaining sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the resolution of the optical sensing device is improved, then the sensing precision is improved, but the size of the sensor chip increases and the manufacturing cost increases significantly
Solution Approach 1:
The patent transitions from a planar electrode configuration to a three-dimensional stacked structure where the second electrode is positioned above the first electrode through vertical stacking. This dimensional change allows increased sensing precision without proportionally increasing chip area, as the electrodes utilize both horizontal and vertical spaces. The through-hole structure enables electrical connection between stacked electrodes while maintaining compact footprint.
Solution Approach 2:
The patent implements a nested configuration where the second electrode is positioned within the vertical space above the first electrode, and the through-hole is formed within the first inorganic layer to enable electrical connection. This nesting approach allows multiple functional elements to occupy the same horizontal footprint at different vertical levels, reducing overall device size while maintaining precision.
2Measurement precision
If the resolution of the optical sensing device is improved, then the sensing precision is improved, but the size of the sensor chip increases
Solution Approach 1:
The patent utilizes vertical stacking to transition from two-dimensional to three-dimensional electrode arrangement. The first and second electrodes are positioned at different vertical levels, allowing the sensing function to be achieved within a smaller horizontal footprint. The through-hole structure enables electrical interconnection between stacked electrodes without requiring additional lateral space.
Solution Approach 2:
The patent employs rounded corners in the electrode and through-hole structures instead of sharp angles. This curvature design allows for smoother transitions and more efficient space utilization in the tight vertical stacking configuration, reducing the overall bounding box size while maintaining electrical connection integrity.
3Reliability
If a through-hole structure is used to connect electrodes, then electrical connection is improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the inorganic layer into segments by forming a through-hole that penetrates the first inorganic layer. This segmentation allows the second electrode to be electrically connected to the first electrode through the through-hole while maintaining the insulating properties of the inorganic layer in other regions. The rounded corner design of the through-hole facilitates cleaner manufacturing by avoiding sharp edges that would require complex machining.
4Ease of manufacture
If the sensor chip size is reduced to lower cost, then manufacturing cost decreases, but the sensing sensitivity may be compromised
Solution Approach 1:
The patent compensates for reduced chip area by utilizing the vertical dimension for electrode stacking. The first and second electrodes are positioned at different heights, effectively increasing the total sensing volume within a smaller horizontal footprint. This dimensional transition maintains sensing sensitivity while reducing the overall chip area and associated manufacturing costs.
Solution Approach 2:
The patent employs a composite structure combining the first inorganic layer, second inorganic layer, and conductive elements in a stacked configuration. This composite arrangement optimizes both electrical connection and sensing performance within a compact volume, achieving cost reduction through smaller chip area while preserving sensitivity through effective use of three-dimensional space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces manufacturing costs and improves signal-to-noise ratio by optimizing structural elements and material selection, enhancing overall performance.
Implementation Method 1
The sensing element in the optical sensing device can convert received light into an electrical signal
Implementation Method 2
the electrical signal that is generated can be transmitted to the driving element and logic circuit
Data Source
AI summary
An electronic device includes a first substrate, a semiconductor element, a first inorganic layer, a first electrode, a second electrode and a conductive element. The first inorganic layer is disposed between the first substrate and the semiconductor element. The first inorganic layer has a first surface adjacent to the semiconductor element, a second surface opposite to the first surface, and a through-hole penetrating from the first surface to the second surface. The first electrode is disposed between the first substrate and the first inorganic layer. The second electrode has a first portion disposed on the second surface of the first inorganic layer, and a second portion disposed in the through-hole of the first inorganic layer. The conductive element is disposed between the first electrode and the second electrode. Moreover, in a cross-sectional view of the electronic device, the first portion of the second electrode has a rounded corner.