Stacked Electronic Component with Divided Electrodes
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Solution Overview
Problem
There is a need for improved signal quality and increased capacity in electronic components, particularly in high-frequency ranges, as existing technologies face challenges in efficiently arranging and connecting multiple electronic components on mounting boards while maintaining compatibility and durability.
Innovation Solution
The solution involves stacking and electrically connecting a first electronic component with a dielectric layer and electrode layers, and a second electronic component with a higher capacitance and equivalent series inductance, using conductive and insulating materials to reduce equivalent series inductance and enhance durability, allowing for efficient arrangement and connection of multiple components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple electronic components are arranged and connected on a mounting board, then capacity increases, but device complexity and space utilization deteriorate
Solution Approach 1:
The patent transitions from planar arrangement of multiple electronic components to a three-dimensional stacked configuration. Multiple capacitor elements are arranged vertically along the thickness direction, allowing multiple components to occupy the same footprint area on the mounting board. This dimensional change enables increased capacity without proportionally increasing device complexity or space requirements.
Solution Approach 2:
The patent combines multiple capacitor elements into a single integrated electronic component. Multiple first capacitors share common first electrode and first terminal, while multiple second capacitors share common second electrode and second terminal. This merging reduces the number of separate components that need to be arranged and connected on the mounting board, thereby reducing device complexity while maintaining increased capacity.
2Reliability
If thin-film capacitor structure is used, then equivalent series inductance decreases and signal quality improves, but capacity is limited
Solution Approach 1:
The patent segments the capacitor structure into multiple identical or different capacitor elements arranged in parallel. Each element maintains the thin-film configuration with low equivalent series inductance, while the parallel combination increases total capacity. The segmentation allows the component to simultaneously achieve the signal quality benefits of thin-film design and the capacity benefits of multiple elements.
Solution Approach 2:
The patent creates a multi-functional capacitor structure that simultaneously provides low equivalent series inductance (through thin-film construction) and high capacity (through parallel arrangement of multiple elements). The shared electrodes and terminals enable the structure to function as both a signal-quality-optimized component and a high-capacity energy storage device.
Data Source
AI summary
An electronic component includes a first electronic component and a second electronic component that is stacked on the first electronic component. A second electrode layer of the first electronic component includes a plurality of divided electrode layers, and a pair of electrodes of the second electronic component are electrically connected to different electrode layers included in the plurality of electrode layers of the second electrode layer, and a first electrode layer of the first electronic component is divided into a plurality of electrode layers to correspond to the electrode layers which are included in the second electrode layer and which are electrically connected to the pair of electrodes of the second electronic component.