Stacked Electronic Module with Through-Substrate Interconnects
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Solution Overview
Problem
Conventional electronic modules with heat sinks are large in size due to the arrangement of power and controlling parts on a single plane, making it difficult to downsize them.
Innovation Solution
The electronic module design involves stacking two substrates with electronic elements connected by conductive members, housed within a heat sink with a cap part and sealing resin to reduce horizontal size and enhance thermal radiation properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If power part and controlling part are arranged on a single plane of the heat sink base plate, then electrical connection and thermal management are simplified, but the overall size of the electronic module becomes large
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration. The controlling part is positioned on the opposite surface of the heat sink base plate relative to the power part, utilizing the vertical dimension to reduce horizontal footprint while maintaining functional connectivity through conductive members that pass through the base plate.
Solution Approach 2:
The controlling part is housed within a housing structure that integrates with the heat sink assembly. The conductive members are embedded within the base plate thickness, nesting connection pathways within the existing structural volume rather than requiring additional external space.
2Ease of manufacture
If multiple electronic parts are mounted on the same substrate surface, then manufacturing process is simplified, but interconnection distance increases causing larger module size
Solution Approach 1:
The conductive members extend vertically through the base plate thickness rather than traveling laterally across the surface. This dimensional change reduces the effective connection path length between power and controlling parts, decreasing parasitic inductance and resistance while maintaining manufacturing simplicity through standardized through-hole or embedded conductor techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for significant downsizing of the electronic module while maintaining effective thermal management and reducing noise emissions by shortening interconnection distances and enhancing thermal resistance.
Implementation Method 1
a heat sink including a base plate that has a housing part therein, and housing the first and second electronic modules in the housing part
Implementation Method 2
The heat sink 130 includes a base plate 131 and a plurality of fins 132 erected on a bottom surface of the base plate 131
Data Source
AI summary
An electronic module 1 includes an electronic module 10 that includes a substrate 11 and an electronic element 12, an electronic module 20 that includes a substrate 21 arranged such that the principal surface 21a faces the principal surface 11a, an electronic element 22 electrically connected to the electronic element 12 with a connecting member 18 therebetween, and an electronic element 23 electrically connected to the electronic element 12 with a connecting member 19 therebetween passing through the substrate 21 in a thickness direction, the electronic module 20 thermally connected to the electronic module 10 by the connecting members 18 and 19, and a heat sink 30 that includes a housing part 31a therein and houses the electronic modules 10 and 20 in the housing part 31a such that the principal surface 11b is in contact with an inner wall surface of the housing part 31a.