Stacked FET RF Switch Biasing for Lower OFF-State Dissipative Loss

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Solution Overview

Problem

Radio-frequency (RF) switches using field-effect transistors (FETs) in an OFF state experience significant dissipative losses due to high impedance, leading to mismatch loss and reduced quality factor in resonant circuits, especially when high voltage is applied, which affects the efficiency of RF signal routing.

Innovation Solution

The implementation of gate-gate, drain-source, and body-body resistors in a biasing architecture for FETs in a stack configuration, which includes a series arm and a shunt arm, to optimize the ON and OFF states of transistors, reducing dissipative losses by increasing Roff to ground and minimizing resistance roll-off over frequency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If FETs are used in OFF state with high impedance for RF switching, then signal routing capability is achieved, but dissipative losses increase significantly

Engineering Contradiction:
Improvedissipative lossesVSAvoidswitching performance
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The patent introduces biasing circuits with resistors (gate-gate, drain-source, body-body) as intermediary elements to control the electrical state of FETs in the stack. These resistors act as mediators to establish appropriate voltage divisions across the FET terminals, ensuring low impedance in ON state and high impedance in OFF state, thereby reducing dissipative losses while maintaining reliable switching performance.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the electrical parameters (voltage, impedance) of the FETs by implementing a biasing architecture that applies specific voltages to gate, drain, and body terminals. By controlling the gate-to-source voltage and body-to-source voltage, the FETs transition between ON and OFF states with optimized impedance characteristics, reducing energy loss during switching operations.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If high voltage is applied to FETs in OFF state, then signal isolation is improved, but mismatch loss and quality factor degradation increase

Engineering Contradiction:
Improvesignal isolationVSAvoidmismatch loss
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent applies different biasing conditions to different parts of the FET structure. Specifically, the body-to-source voltage is optimized independently from the gate-to-source voltage to achieve local optimization of the depletion region characteristics. This local quality control ensures that the FET presents high impedance for signal isolation while minimizing the impact on matching and quality factor.

Inventive Principle:
Principle #3Local quality

3Strength

If FETs are configured in stack configuration, then voltage handling capability is improved, but dissipative losses increase due to high impedance in OFF state

Engineering Contradiction:
Improvevoltage handling capabilityVSAvoiddissipative losses
Core Design Contradiction:
StrengthVSLoss of energy

Solution Approach 1:

The patent segments the voltage handling function across multiple FETs connected in series (stack configuration), where each FET handles a portion of the total voltage. The biasing circuits are designed to distribute voltages appropriately across each FET in the stack, ensuring that each device operates in its optimal region. This segmentation allows high voltage handling while the biasing resistors ensure low impedance in ON state to minimize dissipative losses.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS10693459B2Biasing architectures and methods for lower loss switches
Publication Date: 2020.06.23 SKYWORKS SOLUTIONS INC
  • US10693459B2 patent drawing
  • US10693459B2 patent drawing
  • US10693459B2 patent drawing

AI summary

Biasing architectures and methods for lower loss switches. In some embodiments, a switching device can include a series arm having transistors implemented in a stack configuration between first and second nodes. The switching device can further include a shunt arm having transistors implemented in a stack configuration between the first node and a ground node. The switching device can further include a bias architecture having a series arm bias circuit and a shunt arm bias circuit. The series arm bias circuit can be configured to bias the transistors of the series arm and include a gate-gate resistor that couples each pair of neighboring transistors. The shunt arm bias circuit can be configured to bias the transistors of the shunt arm and include a gate-gate resistor that couples each pair of neighboring transistors.