Stacked Nanosheet FET Source/Drain Layout for Device Separation

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Solution Overview

Problem

Nanosheet technology in CMOS scaling faces issues as devices become smaller and closer together, leading to interference between transistors.

Innovation Solution

A stacked nanosheet FET structure is developed with upper and lower nanosheet transistors, where the upper source/drain is formed during frontside processing and the lower source/drain during backside processing, with differing tip directions and widths to create separation and facilitate contact formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If nanosheet devices are scaled down and placed closer together to increase density, then device integration density is improved, but device interference increases

Engineering Contradiction:
Improvedevice integration densityVSAvoiddevice interference
Core Design Contradiction:
Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The source/drain structure is segmented into multiple distinct regions: upper source/drain regions with upper tips, lower source/drain regions with lower tips, and intermediate regions. This segmentation creates physical separation between stacked nanosheet devices, reducing interference while maintaining high integration density through vertical stacking.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from planar device layout to three-dimensional stacked architecture. By forming upper and lower source/drain regions at different vertical levels with tips extending in opposite directions, the design utilizes the vertical dimension to separate devices that would otherwise interfere in a two-dimensional plane, enabling higher density without increased interference.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Stability of the object's composition

If upper and lower source/drain regions are formed with different tip directions and widths, then device separation is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvedevice separationVSAvoidmanufacturing process complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The upper source/drain regions are formed during frontside processing before the lower source/drain regions are formed during backside processing. This preliminary formation of upper regions with specific tip directions and widths establishes a foundation that guides subsequent processing steps, enabling precise device separation while managing manufacturing complexity through sequential rather than simultaneous formation.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS12615819B2Space confined epi for stacked FET
Publication Date: 2026.04.28 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US12615819B2 patent drawing
  • US12615819B2 patent drawing
  • US12615819B2 patent drawing

AI summary

A microelectronic structure that includes a stacked nanosheet FET transistor that includes an upper nanosheet transistor and a lower nanosheet transistor. The upper nanosheet transistor includes an upper source/drain and the upper source/drain includes an upper tip that is pointed in a first direction. The lower nanosheet transistor includes a lower source/drain and the lower source/drain includes a lower tip pointed in a second direction. The first direction is different than the second direction.