Vertically Stacked Filter-Amplifier Package for Dense I/O
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Solution Overview
Problem
The increasing number of I/O connections in semiconductor chips leads to larger semiconductor packages, increasing costs, and requires higher bonding pad densities, which is challenging to manage effectively in existing technologies.
Innovation Solution
A package structure incorporating a semiconductor substrate with a filter structure and an amplifier, where the filter structure includes an element configured to generate acoustic waves and acoustic reflection layers to optimize signal transmission and reduce package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of I/O connections in semiconductor chips is increased, then the electrical performance and additional functions are improved, but the package size increases and cost increases
Solution Approach 1:
The patent transitions from planar signal transmission to three-dimensional vertical signal transmission by stacking the filter structure directly over the amplifier. This vertical integration allows multiple I/O connections to be accommodated within the same footprint area, effectively increasing the number of connections without proportionally increasing the package area.
Solution Approach 2:
The filter structure is nested directly over the amplifier in a vertical stack configuration, with the filter's acoustic wave generation element positioned above the amplifier's active surface. This nesting approach allows both components to occupy overlapping horizontal space, reducing the overall package footprint while maintaining multiple connection points.
2Adaptability or versatility
If the number of I/O connections in semiconductor chips is increased, then the electrical performance and additional functions are improved, but the cost increases
Solution Approach 1:
The patent combines the filter and amplifier into a single integrated package structure where both components are mounted on the same semiconductor substrate and interconnected through vertical signal paths. This merging reduces the total component count, simplifies the assembly process, and lowers manufacturing costs compared to separate discrete components.
Solution Approach 2:
By moving to vertical stacking, the patent reduces the horizontal footprint required for multiple I/O connections, allowing smaller package sizes that use less substrate material and reduce overall manufacturing complexity and cost.
3Area of stationary object
If the bonding pad density of semiconductor substrates is increased, then the package size is minimized, but the manageability and reliability become challenging
Solution Approach 1:
The patent employs vertical signal transmission paths that extend from the amplifier's active surface upward through the filter structure. This three-dimensional approach reduces the horizontal bonding pad requirements by utilizing the vertical dimension for signal routing, thereby minimizing package size without excessively increasing bonding pad density on the substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes package size while maintaining high signal integrity and reducing heat transfer and delamination risks, thereby addressing the cost and density challenges of increasing I/O connections.
Implementation Method 1
The element is configured to generate an acoustic wave
Implementation Method 2
The first acoustic reflection layer is disposed adjacent to the element. The second acoustic reflection layer is stacked with the first acoustic reflection layer to form an interface therebetween
Implementation Method 3
The cavity is coupled to the element and configured to reflect the acoustic wave
Data Source
AI summary
A package structure is provided. The package structure includes an amplifier and a filter structure. The amplifier has an active surface. The filter structure is disposed over the amplifier, and communicates with the amplifier through a first signal path substantially vertical to the active surface of the amplifier.