Stacked Resonator Filter Layout for Low-Coupling Miniaturization
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Solution Overview
Problem
The challenge of miniaturizing band-pass filters in small-sized communication devices is hindered by strong electromagnetic coupling between resonators, which requires large distances between conductor layers, making it difficult to reduce the size of such filters.
Innovation Solution
A filter design that includes a first terminal, second terminal, first and second ground conductor layers, a first resonator conductor layer between the ground layers, and a through hole connecting the ground and resonator conductor layers, with the resonator conductor layer not directly connected to the second ground layer, allowing for a compact structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the distance between conductor layers is increased to suppress electromagnetic coupling, then electromagnetic coupling is reduced, but the filter size increases
Solution Approach 1:
The patent transitions from planar conductor layer arrangement to a three-dimensional stacked configuration with conductor layers at different heights. The first and second conductor layers are positioned on different planes separated by dielectric layers, enabling vertical stacking that reduces footprint area while maintaining adequate spacing to suppress electromagnetic coupling between layers.
Solution Approach 2:
The patent implements a nested structure where conductor layers and dielectric layers are stacked alternately in a compact configuration. The first conductor layer is embedded within dielectric layers that are themselves embedded within additional dielectric layers, creating a compact nested arrangement that minimizes overall filter size while maintaining electrical isolation.
2Area of stationary object
If the filter is miniaturized, then the footprint is reduced, but electromagnetic coupling between resonators becomes too strong
Solution Approach 1:
By arranging conductor layers in three dimensions with vertical separation through dielectric layers, the patent achieves compact footprint area while maintaining sufficient physical distance between resonating elements. The vertical stacking dimension provides isolation without sacrificing horizontal space.
Solution Approach 2:
Dielectric layers are introduced as intermediary materials between conductor layers containing resonators. These dielectric layers act as isolating barriers that reduce electromagnetic coupling between adjacent conductor layers, enabling closer spacing and smaller footprint while maintaining acceptable coupling levels.
3Ease of manufacture
If conductor layers are arranged on the same plane to simplify structure, then manufacturing is easier, but electromagnetic coupling increases
Solution Approach 1:
The patent moves from two-dimensional planar arrangement to three-dimensional stacked configuration. Conductor layers are positioned on different planes separated by dielectric layers in the vertical dimension, maintaining manufacturing simplicity through layered deposition while effectively reducing electromagnetic coupling through spatial separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables miniaturization of band-pass filters by reducing electromagnetic coupling while maintaining effective signal transmission characteristics.
Implementation Method 1
a first resonator conductor layer constituting a part of a first specific resonator arranged between the first ground conductor layer and the second ground conductor layer
Implementation Method 2
a body composed of a dielectric and integrating the first terminal, the second terminal, the first ground conductor layer, the second ground conductor layer, the first resonator conductor layer, and the first through hole
Data Source
AI summary
A filter includes: a first ground conductor layer and a second ground conductor layer arranged to be spaced from each other, a resonator conductor layer arranged between the first ground conductor layer and the second ground conductor layer and constituting a part of a resonator, a through hole connecting the first ground conductor layers and the resonator conductor layer and constituting a different part of the resonator, and a body. The resonator conductor layer is not directly connected to the second ground conductor layer.