Stacked Filter Arrangement with Substrate and Carrier
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Solution Overview
Problem
Existing filter arrangements for radio systems, such as duplexers, lack flexibility in production methods and often require complex multiplicity of production steps, limiting the choice of materials and processes for different components.
Innovation Solution
A filter arrangement comprising a substrate with series and parallel resonators and a carrier with an inductance, where the substrate and carrier form a stack arrangement, allowing separate optimization of production processes and material selection for each component, and enabling a space-saving design using flip-chip technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the substrate and carrier are integrated into a single structure, then the production process is simplified, but the flexibility in choosing production methods and materials is reduced
Solution Approach 1:
The filter arrangement is divided into two separate components: a substrate containing resonators and a carrier containing inductances. This segmentation allows each component to be produced using optimized, independent processes and materials, thereby maintaining manufacturing simplicity while preserving flexibility in production method selection for each component type.
Solution Approach 2:
The substrate is mounted onto the carrier in a nested configuration, forming a compact integrated structure. This nesting approach enables the combination of separately produced components into a unified assembly, achieving both production flexibility and structural integration benefits.
2Area of stationary object
If all components are arranged on a single substrate, then the area is reduced, but the production process complexity increases
Solution Approach 1:
The filter arrangement components are segmented into two groups: resonators on the substrate and inductances on the carrier. This segmentation reduces the area required on each individual component while avoiding the complexity of integrating all components onto a single substrate, as each segment can be optimized independently.
Solution Approach 2:
The arrangement transitions from a two-dimensional layout on a single substrate to a three-dimensional stacked configuration with substrate and carrier positioned at different vertical levels. This dimensional change enables compact area utilization while simplifying production by allowing separate processing of each layer.
3Adaptability or versatility
If the substrate and carrier are separated, then the flexibility in material and process optimization is improved, but the overall device size increases
Solution Approach 1:
The substrate is mounted directly onto the carrier in a nested, space-efficient configuration. This nesting approach allows the separately produced components to be combined in a compact arrangement, achieving both material/process optimization flexibility and minimized overall device volume.
Solution Approach 2:
By arranging the substrate and carrier in a vertical stacked configuration rather than a lateral arrangement, the design achieves compact volume utilization. The separation of components enables optimization flexibility while the three-dimensional stacking minimizes the overall footprint and volume of the filter arrangement.
Data Source
AI summary
The invention relates to a filter arrangement (10) comprising a substrate (16) having a first series resonator (11) and a first and a second parallel resonator (12, 13). The filter arrangement (10) further comprises a carrier (18), on which the substrate (16) is arranged and which comprises a first inductor (17), the first connection of which is coupled to a first connection of the first series resonator (11) by means of the first parallel resonator (12) and to a second connection of the first series resonator (11) by means of the second parallel resonator (13).