Stacked GaN Die Circuit for In-Process Component Testing
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Solution Overview
Problem
Existing electronic circuit manufacturing processes lack efficient methods for testing components before the circuit is fully assembled, leading to increased manufacturing and design costs.
Innovation Solution
The proposed solution involves stacking a first die with a GaN transistor and a second die, where an element of the second die electrically connects nodes of the first die to the conduction and control nodes of the GaN transistor, allowing for component testing during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional wire bonding is used to connect nodes, then electrical connections are established, but manufacturing cost increases and parasitic elements are introduced
Solution Approach 1:
The patent merges the connection function with the die structure itself by using conductive tracks and pads directly on the die surface to establish electrical connections between nodes, eliminating the need for separate wire bonding operations. This integration reduces manufacturing complexity while maintaining reliable electrical connections.
Solution Approach 2:
The patent extracts the wire bonding operation from the manufacturing process entirely by providing direct conductive paths through die structure elements such as conductive tracks, pads, and vias. This removal of the wire bonding step eliminates associated parasitic elements and reduces manufacturing complexity.
2Ease of manufacture
If components are tested only after full assembly, then manufacturing process is simplified, but testing capability is lost and costs increase
Solution Approach 1:
The patent enables preliminary testing of components and interconnections during the manufacturing process itself, before final assembly is complete. Test nodes and conductive structures are incorporated into the die design to allow intermediate testing stages, ensuring quality assurance while maintaining manufacturing simplicity.
3Adaptability or versatility
If additional connection elements are added to enable testing, then testing capability is improved, but device complexity increases
Solution Approach 1:
The patent designs conductive structures such as tracks, pads, and nodes to serve multiple functions: they provide electrical connections for normal circuit operation and simultaneously serve as test access points. This multi-functionality enables testing capabilities without adding separate dedicated test structures, thereby avoiding increased device complexity.
Data Source
AI summary
An electronic circuit includes a first die, having a GaN transistor, and a second die, stacked so that an element of the second die electrically connects a first node and a second nodes of the first die respectively coupled to a conduction node and to a control node of the GaN transistor.