Stacked Inverter Half-Bridge Layout for Low-Inductance Cooling
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Solution Overview
Problem
Existing power electronics modules in electric vehicles face challenges with non-equal DC current connections leading to high stray inductance and complex cooling arrangements, which hinder compact design and component selection.
Innovation Solution
A compact half-bridge arrangement is proposed, where switch modules are stacked with AC and DC taps, and semiconductor switches are surrounded by insulating material, with heat sinks and signal pins optimized for efficient cooling and signal transmission, allowing for a sandwich-like construction that reduces installation space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling links are connected in parallel and arranged on a board, then effective cooling is achieved, but the DC current connections of the high-side and low-side switches are not equal in length and high stray inductance arises
Solution Approach 1:
The patent transitions from a planar arrangement of cooling links on a board to a three-dimensional stacked configuration where half-bridges are arranged vertically. This dimensional change allows the DC current connections to be equal in length by positioning switches and connections in the vertical dimension, thereby reducing stray inductance while maintaining effective cooling through the stacked structure.
Solution Approach 2:
The patent divides the inverter into multiple independent half-bridge modules that can be stacked and arranged flexibly. Each half-bridge module contains its own switches and cooling links, allowing for optimized current path lengths within each module while maintaining overall cooling effectiveness through the modular stacked arrangement.
2Temperature
If press-pack components with specific construction are used, then cooling is achieved, but component selection is reduced and a structurally complex clamping assembly is necessary
Solution Approach 1:
The patent employs standardized semiconductor switches with integrated cooling links that can be used across different half-bridge modules. These universal components eliminate the need for specialized press-pack constructions and complex clamping assemblies, as the standardized modules can be stacked and connected using simpler, more flexible mounting structures.
Solution Approach 2:
The patent changes the construction approach from rigid press-pack components to flexible printed circuit board-based connections. This parameter change in the connection method allows for simplified assembly without complex clamping mechanisms, while maintaining effective thermal and electrical connections through the flexible PCB structure.
3Volume of moving object
If half-bridges are stacked one on top of another, then space requirement is reduced, but DC current connections may become unequal in length
Solution Approach 1:
The patent optimizes the stacked configuration by utilizing vertical positioning and flexible PCB routing to ensure equal current connection lengths despite the compact stacked arrangement. The flexible PCB allows current paths to be routed equally through the stacked half-bridges, maintaining low stray inductance while achieving space savings through vertical stacking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a more compact and efficient power electronics module design with improved cooling and reduced stray inductance, enhancing the performance and space optimization of electric drive systems in vehicles.
Implementation Method 1
respective heat sinks are arranged on the cooling connection surfaces of the switch modules
Implementation Method 2
heat sinks and signal pins optimized for efficient cooling
Data Source
AI summary
A half-bridge arrangement includes an AC tap, DC taps, and a half-bridge including first and second topological switches formed from switch modules having semiconductor switches, each switch module having a flat top side with a cooling connection surface and an opposite underside, and side regions. A first current connection lug and signal pin project at first side regions of each switch module, and a second current connection lug projects at second side regions opposite the first side region. The switch modules are stacked so that current connection lugs of a first side region and a second side region lie one above another. Signal pin free ends point in the same direction, and the second current connection lug a switch module is provided along a partial region of the second side region and the signal pins of the other switch module are next to the second current connection lug.