Stacked Heat Dissipating Module for Electronic Devices
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Solution Overview
Problem
Conventional electronic devices face challenges in heat dissipation due to increasing complexity of electronic components and spatial arrangements, leading to ineffective operation of components like light emitting or signal components when a single heat sink is used, or excessive heat when the heat sink is omitted.
Innovation Solution
A stacked heat dissipating module comprising a holding frame, multiple heat conducting medium layers, and heat sink layers stacked together, with housing holes to expose components and facilitate heat dissipation while maintaining functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single heat sink is mounted on electronic components, then heat dissipation is improved, but exposed components (light emitting, signal emitting/receiving components) become ineffective
Solution Approach 1:
The heat sink is divided into multiple heat sink layers (first heat sink layer, second heat sink layer, etc.) that are stacked and positioned at different locations. This segmentation allows different regions to serve different functions: some areas provide heat dissipation while others leave components exposed for their intended operations.
Solution Approach 2:
Different regions of the heat dissipation system are designed with different properties. Certain areas have heat sinks mounted to dissipate heat, while other areas are left without heat sinks to allow light emitting or signal emitting/receiving components to function properly. This local differentiation resolves the conflict between heat dissipation and component functionality.
2Reliability
If the heat sink is omitted to allow component exposure, then component functionality is improved, but the device becomes too hot to operate
Solution Approach 1:
The heat dissipation system is segmented into multiple layers with heat conducting medium layers and heat sink layers alternated. This segmentation enables selective heat dissipation in specific regions while maintaining component exposure in other regions, thereby controlling operating temperature without sacrificing functionality.
Solution Approach 2:
The solution transitions from a single-plane heat sink arrangement to a multi-layer stacked configuration in the vertical dimension. This dimensional change allows heat dissipation to occur through multiple levels while maintaining selective exposure of components, effectively managing temperature without compromising functionality.
3Temperature
If multiple heat conducting medium layers and heat sink layers are stacked, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
Multiple heat conducting medium layers and heat sink layers are merged into a single integrated stacked module. This combining approach consolidates what would otherwise be separate components into one unified structure, improving heat dissipation efficiency while managing complexity through integration rather than proliferation of separate parts.
Solution Approach 2:
The stacked heat dissipation module serves multiple functions simultaneously: it dissipates heat from various electronic components, maintains selective exposure of components for their intended operations, and provides a structured assembly that can be mounted as a single unit. This multi-functionality justifies the stacked structure by delivering multiple benefits from one integrated system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat generated by electronic components, ensuring proper operation while allowing exposed components to function effectively by utilizing multiple heat conducting and sink layers to manage heat efficiently within the electronic device.
Implementation Method 1
The at least one first heat conducting medium layer 21 is mounted on the at least one heating component 62 to dissipate heat generated from the at least one heating component
Implementation Method 2
the first heat sink layer 30, at least one second heat conducting medium layer 40A, 40B and at least one second heat sink layer 50 stacked with each other... dissipates heat generated from the at least one heating component
Implementation Method 3
the first heat sink layer 30, at least one second heat conducting medium layer 40A, 40B and at least one second heat sink layer 50 stacked with each other... dissipates heat generated from the at least one heating component
Data Source
AI summary
A stacked heat dissipating module of an electronic device has a holding frame, and at least one first heat conducting medium layer, a heat dissipating medium layer, a first heat sink layer, at least one second heat conducting medium layer and at least one second heat sink layer stacked with each other. The at least one first heat conducting medium layer is mounted on at least one heating component of the electronic device to dissipate heat generated from the at least one heating component. Moreover, the holding frame, the heat conducting medium layers and the heat sink layers have corresponding housing holes for exposing an exposed component of the electronic device to bring the exposed component's function into full play.