Stacked Processor-Memory Heat Sink Layout for Thermal Reliability
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Solution Overview
Problem
Electronic devices, particularly in vehicles, face challenges in achieving high thermal and electrical reliability due to the increasing miniaturization and complexity of components, which often results in inadequate cooling and signal transmission under harsh conditions.
Innovation Solution
The configuration of an electronic device comprising a motherboard, a power converter module, a processor module, and a memory module, with a heat sink thermally coupled to the processor and memory modules, arranged between the motherboard and the heat sink, allowing for efficient heat removal and separate signal and power transmission paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If components are miniaturized and arranged with smaller spacing to increase functionality, then the electronic device can achieve higher integration and more features, but thermal management becomes more difficult and heat accumulation increases
Solution Approach 1:
The patent transitions from planar 2D component arrangement to 3D vertical stacking, where processor modules, memory modules, and power converter modules are arranged in multiple layers above the motherboard. This vertical dimensionality change allows higher component integration density while maintaining adequate thermal spacing and enabling independent thermal management for each module layer.
Solution Approach 2:
The patent divides the electronic device into functionally independent modules (processor module, memory module, power converter module) that can be separately managed thermally. Each module has its own thermal management approach, allowing optimized heat dissipation paths for high-heat components while isolating them from heat-sensitive components.
2Volume of moving object
If multiple components are integrated into a compact arrangement, then device size is reduced, but thermal reliability and heat removal efficiency deteriorate
Solution Approach 1:
The patent uses vertical 3D stacking to reduce the horizontal footprint of the device while maintaining adequate thermal management space. Multiple modules are arranged in layers above the motherboard, achieving compact form factor without compromising thermal reliability through proper vertical spacing and dedicated heat sinks for each layer.
Solution Approach 2:
The patent introduces intermediate thermal management structures including heat sinks, thermal interface materials, and cooling channels between the modules and the environment. These intermediary elements facilitate efficient heat transfer from compactly arranged modules to the external cooling system, maintaining thermal reliability in a reduced device volume.
3Ease of operation
If modules are arranged in a compact vertical stack, then single-sided cooling becomes feasible, but heat cross-flow between modules may occur
Solution Approach 1:
The patent extracts and isolates heat-generating modules (processor module, power converter module) from heat-sensitive modules (memory module) in the vertical stack. By physically separating these modules and providing dedicated heat sinks for each, the design prevents heat cross-flow while enabling simplified single-sided cooling from the bottom of the device.
Solution Approach 2:
The patent implements rapid heat extraction from high-heat modules using dedicated heat sinks and thermal management structures positioned immediately adjacent to each heat-generating component. This rushes heat away from the module stack before it can cross-flow to adjacent modules, enabling effective single-sided cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures high thermal reliability and efficient cooling, preventing heat cross-flow and maintaining signal integrity, even in single-sided cooling environments, while supporting high-performance computing applications like autonomous driving.
Implementation Method 1
the heat sink is thermally coupled at least with the processor module and the memory module for removing heat
Data Source
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AI summary
An electronic device (100) which comprises a motherboard (102), a power converter module (104), a processor module (106), a memory module (108), and a heat sink (110), wherein at least one of the power converter module (104), the processor module (106) and the memory module (108) is mounted on the motherboard (102) for signal transmission and electric power supply, wherein the heat sink (110) is thermally coupled at least with the processor module (106) and the memory module (108) for removing heat, and wherein the power converter module (104), the processor module (106) and the memory module (108) are arranged between the motherboard (102) and the heat sink (110).