Stacked IC Bond Pad Layout for Flat, High-Adhesion Chip Bonding
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Solution Overview
Problem
Existing stacked IC devices face issues with non-bond regions, increased design complexity, and fabrication costs due to uniform pitch conductive bond pads leading to height variations and reduced bonding adhesion between chips, which affect yield and performance.
Innovation Solution
The solution involves configuring conductive bond pads with varying pitches in different regions, where the pads in one region have a higher density and uniform pitch aligned with photodetectors, while those in adjacent regions have a lower density and non-uniform pitch, reducing complexity and fabrication costs, and ensuring a flat bonding surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If uniform pitch conductive bond pads are used, then alignment with photodetectors is improved, but height variations and reduced bonding adhesion occur
Solution Approach 1:
The patent applies local quality by implementing different pitch configurations in different regions of the bond pad array. A first region contains conductive bond pads with a first pitch optimized for alignment with photodetectors, while a second region contains conductive bond pads with a second pitch that maintains a flat bonding surface and prevents height variations. This regional differentiation resolves the contradiction by allowing each region to optimize for its specific function.
2Measurement precision
If uniform pitch conductive bond pads are used, then alignment with photodetectors is improved, but design complexity and fabrication costs increase
Solution Approach 1:
The patent reduces design complexity by implementing local quality with region-specific pitch configurations. Instead of using a single uniform pitch across the entire bond pad array, the design divides the array into regions with different pitch values optimized for their specific functions. This approach maintains alignment precision where needed while simplifying the overall design and fabrication process by allowing each region to be independently optimized.
3Reliability
If varying pitch conductive bond pads are used, then bonding adhesion and flat surface are improved, but alignment with photodetectors may be affected
Solution Approach 1:
The patent resolves this contradiction by applying local quality with spatially differentiated pitch configurations. The first region uses a first pitch that ensures precise alignment with photodetectors, while the second region uses a second pitch that maintains a flat bonding surface and prevents height variations. This regional differentiation allows each pitch configuration to optimize for its specific function without compromising the other region's performance.
4Productivity
If higher density bond pads are used, then transmission efficiency is improved, but RC delay increases
Solution Approach 1:
The patent applies local quality by implementing different pitch configurations in different regions. The first region with higher bond pad density optimizes for transmission efficiency by providing more connection points for photodetectors, while the second region with lower bond pad density reduces RC delay by decreasing the total capacitive load. This regional differentiation allows the system to optimize for both transmission efficiency and speed simultaneously.
Data Source
AI summary
Various embodiments of the present disclosure are directed towards a device including an interconnect structure over a substrate. A bond structure is over the interconnect structure. The bond structure includes a first plurality of conductive bond pads disposed in a first region and a second plurality of conductive bond pads disposed in a second region. The second region is adjacent to at least one side of the first region. A first pitch of the first plurality of conductive bond pads is less than a second pitch of the second plurality of conductive bond pads.