Interconnection Bridge Layout for Stacked IC Bandwidth Density
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Solution Overview
Problem
Integrated circuit packages with stacked devices face limitations in interconnect density and size ratios between levels, constraining bandwidth and application flexibility due to high-density interconnection bonds being limited to individual device stacks and size relationships.
Innovation Solution
Incorporating a bridge structure within the integrated circuit assembly to electrically connect integrated circuit devices across levels, allowing for flexible size and function relationships between stacked levels and enabling wider application of high-density interconnect bond structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If high-density interconnection bonds are used within individual integrated circuit device stacks, then interconnect density is improved, but the device size ratio between stacked levels is constrained
Solution Approach 1:
The patent introduces a carrier board as an intermediary component between stacked integrated circuit devices. This carrier board provides an external interconnection framework that mediates the bonding between devices of different sizes, allowing high-density interconnect bonds to be established without being constrained by the size ratios of the devices themselves. The carrier board acts as a flexible intermediary that can accommodate various device size relationships while maintaining high interconnect density.
2Adaptability or versatility
If integrated circuit devices of different sizes are stacked, then application flexibility is improved, but interconnect density is reduced
Solution Approach 1:
The patent transitions from a direct vertical stacking approach to a dimensionally expanded architecture using a carrier board. By introducing the carrier board as an intermediate plane, devices of different sizes can be positioned and interconnected in a expanded dimensional space, allowing application flexibility without sacrificing interconnect density. The carrier board enables devices to be interconnected through additional spatial dimensions rather than being limited to direct face-to-face bonding.
3Ease of manufacture
If carrier level devices are larger than non-carrier level devices, then fabrication process flow is simplified, but device size ratio flexibility is constrained
Solution Approach 1:
The patent segments the fabrication process into distinct stages: device fabrication, device bonding to carrier board, and subsequent interconnections. This segmentation allows each device to be fabricated independently with optimal sizing for its specific function, then bonded to the carrier board where size ratio constraints are eliminated. The carrier board serves as a common platform that receives and interconnects devices of various sizes without requiring size-matching between stacked levels.
Data Source
AI summary
An integrated circuit assembly may be formed with a bridge incorporated into at least one level structure of the integrated circuit assembly, which electrically interconnects at least two integrated circuit devices in another level structure of the integrated circuit assembly. In one example, the integrated circuit assembly may include a first level structure that comprises at least a first integrated circuit device and a second integrated circuit device, and a second level structure comprising at least one integrated circuit device electrically attached to the first integrated circuit device of the first level structure and the bridge forming an electrical attachment between the first integrated circuit device of the first level structure and the second integrated circuit device of the first level structure.