Stacked IC Packaging with Exposed Leads for Thermal Management
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in achieving miniaturization, increased density, thermal efficiency, and cost reduction while maintaining reliability, as existing solutions do not adequately address the need for smaller, thinner, and more efficient packaging with improved thermal management and cost-effectiveness.
Innovation Solution
The method involves forming a base lead with an outer and inner protrusion and a recess, a stack lead with an elongated portion, mounting the base and stack integrated circuits, connecting them through leads, and encapsulating them with the leads exposed to enhance integration and thermal convection, while maintaining cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If integrated circuits are stacked into a single package to increase density, then packaging density is improved, but thermal efficiency deteriorates due to heat accumulation in the stacked structure
Solution Approach 1:
The patent transitions from planar packaging to three-dimensional stacked packaging, allowing multiple integrated circuits to be arranged vertically. This dimensional change increases packaging density while the exposed lead structure provides thermal pathways that address heat accumulation in the stacked configuration.
Solution Approach 2:
The patent extracts certain leads from the encapsulated region and exposes them on the external surface. These exposed leads serve dual functions: electrical connection and thermal convection pathways, thereby resolving the thermal efficiency problem while maintaining the high-density stacked structure.
2Volume of moving object
If integrated circuits are made smaller and thinner to reduce product size, then device dimensions are improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the lead structure into encapsulated portions and exposed portions. This segmentation allows the manufacturing process to handle different regions with different requirements, simplifying the overall manufacturing of small, thin devices while maintaining electrical and thermal functionality.
Solution Approach 2:
The exposed leads serve multiple functions simultaneously: electrical connection, thermal convection, and structural support. This multi-functionality reduces the number of separate components needed, thereby reducing manufacturing complexity despite the small device size.
3Adaptability or versatility
If more integrated circuits are integrated into each package to increase functionality, then device functionality is improved, but cost increases
Solution Approach 1:
The patent merges multiple integrated circuits into a single stacked package, achieving high functionality in one unit. The shared encapsulation and common exposed lead structure reduce per-unit manufacturing costs compared to packaging each circuit separately.
Solution Approach 2:
By stacking circuits vertically rather than arranging them planarly, the patent increases functionality within the same footprint. This three-dimensional arrangement allows more circuits to be packaged without proportionally increasing manufacturing complexity or cost.
4Reliability
If leads are encapsulated completely to protect internal structures, then reliability is improved, but thermal dissipation deteriorates
Solution Approach 1:
The patent extracts certain leads from the encapsulated region and exposes them on the external surface. These exposed leads provide thermal convection pathways while the encapsulated portion maintains structural protection, thereby resolving the contradiction between reliability and thermal dissipation.
Solution Approach 2:
The patent applies different treatments to different regions of the lead structure: encapsulation for structural protection in critical areas and exposure for thermal dissipation in areas where heat convection is beneficial. This local differentiation resolves the contradiction between protection and heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient integration, thermal efficiency, and cost-effective manufacturing by exposing the leads for improved heat dissipation and connection, addressing the limitations of existing packaging systems.
Implementation Method 1
exposing the leads for improved heat dissipation
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a base lead having an outer protrusion and an inner protrusion with a recess in between; forming a stack lead having an elongated portion; mounting a base integrated circuit over the inner protrusion or under the elongated portion; mounting the stack lead over the base lead and the base integrated circuit; connecting a stack integrated circuit and the stack lead with the stack integrated circuit over the base integrated circuit; and encapsulating at least a portion of both the base integrated circuit and the stack integrated circuit with the base lead and the stack lead exposed.