Thermal Management for Stacked IC Devices
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Solution Overview
Problem
In integrated circuit devices, the increased density and power consumption lead to elevated junction temperatures, particularly in stacked configurations, where internally positioned ICs are isolated from efficient thermal management due to inefficient thermal conductors and intervening layers, causing potential damage or performance throttling.
Innovation Solution
A heat dissipation device with a fluid chamber is implemented, allowing direct contact with integrated circuit devices, and channels in underfill materials facilitate heat transfer from the devices to the fluid, enhancing thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple integrated circuit devices are stacked to increase packaging density, then packaging density is improved, but thermal management efficiency deteriorates because internally positioned devices are isolated from heat spreaders by inefficient thermal conductors and intervening layers
Solution Approach 1:
The patent introduces a substrate with enhanced thermal conductivity as an intermediary between the internally positioned integrated circuit devices and the heat spreader. This substrate acts as a thermal mediator that efficiently conducts heat away from devices that would otherwise be thermally isolated by poor-conducting intervening layers, thus resolving the thermal management issue while maintaining high packaging density
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for stacking, enables electrical interconnections between devices, and now also serves as a thermal management pathway. By making the substrate thermally conductive, it simultaneously fulfills structural, electrical, and thermal roles, allowing high-density stacking without compromising thermal efficiency
2Productivity
If higher power density is achieved through miniaturization, then productivity is improved, but temperature increases which may cause damage or throttling
Solution Approach 1:
The thermally conductive substrate acts as an intermediary heat transfer medium between the high-power-density integrated circuit devices and the heat spreader, enabling efficient thermal management that allows sustained high power density operation without excessive temperature rise
Solution Approach 2:
The patent employs a liquid coolant flowing through channels in the heat spreader to actively remove heat from the integrated circuit devices. This fluid-based cooling system efficiently transfers heat away from the high-power-density devices, preventing temperature-related damage or performance throttling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the risk of temperature-related damage and performance throttling by ensuring efficient heat removal from stacked integrated circuit devices, maintaining performance and preventing damage.
Implementation Method 1
a heat transfer fluid of a heat dissipation device is in physical contact with stacked integrated circuit devices within an integrated circuit device package
Implementation Method 2
channels in underfill materials facilitate heat transfer from the devices to the fluid
Data Source
AI summary
An integrated circuit assembly may be formed having a substrate, a first integrated circuit device electrically attached to the substrate, a second integrated circuit device electrically attached to the first integrated circuit device, and a heat dissipation device defining a fluid chamber, wherein at least a portion of the first integrated circuit device and at least a portion of the second integrated circuit device are exposed to the fluid chamber. In further embodiments, at least one channel may be formed in an underfill material between the first integrated circuit device and the second integrated circuit device, between the first integrated circuit device and the substrate, and/or between the second integrated circuit device and the substrate, wherein the at least one channel is open to the fluid chamber.