Stacked IC Module Interposer with Suspended Mirrored Chips
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Solution Overview
Problem
Current integrated circuit systems face challenges in achieving smaller dimensions, lower costs, increased functionality, and improved reliability while maintaining high performance and thermal cooling, with existing solutions failing to provide a comprehensive solution for these requirements.
Innovation Solution
The proposed solution involves a stacked configuration of integrated circuit devices with a module interposer, outer and mirrored chip assemblies, and a carrier, where the mirrored chip assembly is suspended above the carrier's second side, allowing for increased capacity, simplified manufacturing, and improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If integrated circuit devices are arranged in a stacked configuration, then device capacity and chip density are improved, but thermal management becomes more difficult
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional stacked configuration, arranging integrated circuit devices vertically above and below the module interposer. This dimensional change increases device capacity and chip density while the suspended configuration and gaps provide thermal pathways to manage heat in the stacked structure.
Solution Approach 2:
The module interposer acts as an intermediary structure between the stacked integrated circuit devices. It provides mechanical support, electrical interconnection, and thermal management pathways, mediating between the heat-generating devices and the carrier to facilitate heat dissipation.
2Quantity of substance
If integrated circuit devices are arranged in a stacked configuration, then chip density is improved, but manufacturing complexity increases
Solution Approach 1:
The system is segmented into distinct functional modules: the module interposer with its first and second sides, outer chip assemblies mounted on the first side, and mirrored chip assemblies mounted on the second side. This segmentation allows each module to be manufactured and tested separately before final assembly, reducing overall manufacturing complexity despite the three-dimensional configuration.
Solution Approach 2:
The patent employs mirrored chip assemblies that are essentially copies of the outer chip assemblies, mounted on the opposite side of the module interposer. This copying approach standardizes the manufacturing process and allows for modular production, where once a chip assembly design is validated, identical copies can be produced on the other side of the interposer.
3Quantity of substance
If integrated circuit devices are arranged in a stacked configuration, then device capacity is improved, but device size increases
Solution Approach 1:
The patent utilizes the vertical dimension by stacking integrated circuit devices above and below the module interposer rather than arranging them in a planar configuration. This allows device capacity to increase while maintaining a compact footprint, as the stacking extends in the vertical direction rather than expanding the horizontal area.
Solution Approach 2:
The integrated circuit devices are nested in a stacked configuration around the module interposer, with outer chip assemblies on one side and mirrored chip assemblies on the other. This nesting arrangement maximizes the use of available space and allows high device capacity within a compact overall device size.
Data Source
AI summary
A system and method of manufacture of an integrated circuit device system includes: a module interposer having a module first side and a module second side; an outer chip assembly mounted to the module first side; a mirrored chip assembly mounted to the module second side, the mirrored chip assembly below the outer chip assembly; and a carrier attached to the module second side, the carrier includes a carrier first side and a carrier second side, the mirrored chip assembly suspended above the carrier first side.