Stacked IC Security via Interposer Vias

The patent transitions from planar interconnect layouts to a three-dimensional stacked architecture where interconnects are routed through vertical vias between layers. This dimensional change allows interconnects to be enclosed within the stack structure rather than exposed on a single plane, thereby improving security while maintaining space efficiency.

The patent introduces an interposer layer as an intermediary component between the IC die and external packaging. This interposer contains through-vias that route signals vertically, acting as a mediator that shields the actual IC die interconnects from direct access while enabling electrical communication. The interposer serves as a security barrier that prevents direct probing of sensitive interconnects.

The patent divides the interconnect structure into segmented through-vias distributed across the interposer layer. Rather than requiring a single complex via structure, the solution uses multiple simpler through-vias that can be manufactured using standard via formation processes. Each via is a discrete, manageable feature that can be created, filled, and planarized independently.

The interposer portion serves multiple functions simultaneously: it provides mechanical support for the IC die, routes electrical signals through through-vias, enables thermal management pathways, and acts as a security barrier. This multi-functionality reduces the need for additional specialized components, thereby managing manufacturing complexity while achieving reliable electrical connectivity.