Stacked IC Package with Cavity Interposer for Compact Footprint
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Solution Overview
Problem
Conventional integrated circuit package designs have a large footprint, which is undesirable in applications with limited mounting space, and previous solutions have not effectively addressed the need for increased circuitry without increasing the package size, leading to issues with electrical interconnects and device integration.
Innovation Solution
A stacked integrated circuit package system is developed, comprising a base package with a cavity and exposed interposer, an intermediate package mounted over the base interposer, and a top package mounted over the intermediate package, using intra-stack interconnects like solder balls for electrical connections, allowing for reduced profile and complex internal interconnections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple die are stacked within a single package to increase circuit density, then the amount of circuitry in the package is improved, but the footprint of the package on the mounting surface increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of integrated circuit die to a three-dimensional stacked configuration. Multiple die are arranged vertically in layers (first layer, second layer, third layer) and interconnected through vertical interconnect structures, enabling increased circuit density without expanding the horizontal footprint on the mounting surface.
Solution Approach 2:
The patent implements a nested structure where multiple integrated circuit die are contained within a single package housing. The die are stacked one above another in a compact arrangement, with each die nested within the vertical space occupied by the package, allowing multiple functional units to coexist in a confined volume.
2Ease of manufacture
If conventional packaging methods are used for stacked die, then manufacturing is simpler, but electrical interconnect reliability and interconnect length are worsened
Solution Approach 1:
The patent introduces intermediate interconnect structures (such as vertical conductors, through-silicon vias, or bump interconnects) that mediate the electrical connection between stacked die layers. These intermediary elements provide reliable electrical pathways through the vertical stack, enabling signal transmission between layers while maintaining connection integrity despite the three-dimensional arrangement.
Solution Approach 2:
The patent divides the electrical interconnection system into segmented components: individual interconnect structures for each die layer, separate bonding interfaces, and modular connection points. This segmentation allows each interconnect element to be optimized for its specific function and position in the stack, improving overall reliability while enabling systematic manufacturing processes.
Data Source
AI summary
A method for manufacturing of a stacked integrated circuit package system includes: providing a base integrated circuit package having a base encapsulation with a cavity therein and a base interposer exposed by the cavity; mounting an intermediate integrated circuit package over the base interposer; and mounting a top integrated circuit package over the intermediate integrated circuit package.