Stacked IC Package Layout for Heat Dissipation and CTE Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in miniaturization and thermal management of integrated circuit packages due to increasing integration density and the need for smaller, more efficient packaging techniques, particularly in stacked semiconductor devices where thermal damage from coefficient of thermal expansion (CTE) mismatch can occur.
Innovation Solution
The solution involves direct bonding of integrated circuit dies to each other and embedding heat dissipation structures within the packages, using encapsulants and dummy dies with similar thermal expansion coefficients to prevent damage and enhance thermal management, while also forming connectors for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If integrated circuit dies are stacked to reduce physical size, then integration density and miniaturization are improved, but thermal management becomes more difficult and thermal damage from CTE mismatch occurs
Solution Approach 1:
The patent embeds heat dissipation structures (such as heat sinks or thermal vias) within the stacked die configuration, placing thermal management components inside the existing package structure rather than adding external components. This nested approach dissipates heat effectively while maintaining the compact form factor of the stacked device.
Solution Approach 2:
The patent employs materials with matched coefficients of thermal expansion (CTE) in the stacked die structure, using composite material layers that are specifically selected to have compatible thermal expansion properties. This prevents thermal damage from CTE mismatch while the composite structure provides enhanced thermal conduction pathways for heat dissipation.
2Volume of moving object
If integrated circuit dies are stacked to reduce physical size, then integration density is improved, but thermal damage from coefficient of thermal expansion (CTE) mismatch occurs
Solution Approach 1:
The patent modifies the thermal and mechanical parameters of the package structure by selecting materials with specific CTE values that match across die interfaces. The encapsulant and interposer materials are chosen to have CTE parameters that bridge the mismatch between different semiconductor dies, preventing thermal stress and reliability failures during temperature cycling.
Solution Approach 2:
The patent employs materials with matched coefficients of thermal expansion (CTE) in the stacked die structure, using composite material layers that are specifically selected to have compatible thermal expansion properties. This prevents thermal damage from CTE mismatch while the composite structure provides enhanced thermal conduction pathways for heat dissipation.
3Volume of moving object
If direct bonding of dies is used to create compact packages, then miniaturization is improved, but manufacturing complexity increases
Solution Approach 1:
The patent performs preliminary bonding of dies to interposers or carrier substrates before final stacking, using temporary mounting structures that simplify the bonding process. Electrical connections and alignment features are established in advance during the preliminary bonding stage, reducing the complexity of the final stack assembly and enabling more straightforward manufacturing of the compact package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the creation of compact, thermally stable integrated circuit packages with improved heat dissipation, preventing thermal damage and enabling efficient electrical connectivity, thus addressing the challenges of miniaturization and thermal management in stacked semiconductor devices.
Implementation Method 1
embedding heat dissipation structures within the packages, using encapsulants and dummy dies with similar thermal expansion coefficients to prevent damage
Data Source
AI summary
A package and a method of forming the same are provided. The package includes: a die stack bonded to a carrier, the die stack including a first integrated circuit die, the first integrated circuit die being a farthest integrated circuit die of the die stack from the carrier, a front side of the first integrated circuit die facing the carrier; a die structure bonded to the die stack, the die structure including a second integrated circuit die, a backside of the first integrated circuit die being in physical contact with a backside of the second integrated circuit die, the backside of the first integrated circuit die being opposite the front side of the first integrated circuit die; a heat dissipation structure bonded to the die structure adjacent the die stack; and an encapsulant extending along sidewalls of the die stack and sidewalls of the heat dissipation structure.