Stacked IC Package Adapter Die for Flexible Power Routing
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Solution Overview
Problem
Existing IC packages face challenges in integrating large-sized circuit elements due to limited TSV keep out zones, restricting the arrangement of circuit elements in logic dies when stacked with memory dies, and requiring separate power management circuits for each die type.
Innovation Solution
A stacked IC package design with adapter dies that include power and signal transmission paths with voltage conversion and level shift circuits, allowing non-overlapping power and signal regions between dies, and incorporating power management circuits within the adapter die to facilitate flexible die placement and efficient heat distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If TSV is formed in the vertical direction to electrically connect stacked dies, then electrical connection between dies is achieved, but the location for TSV formation is limited creating a TSV keep out zone that restricts circuit element arrangement
Solution Approach 1:
The patent transitions from purely vertical TSV connections to a three-dimensional power transmission path that includes vertical segments combined with horizontal segments within the adapter die. This dimensional expansion allows power transmission regions in stacked dies to be positioned at different horizontal locations, eliminating the need for vertical alignment and removing the TSV keep out zone constraint on circuit element arrangement.
Solution Approach 2:
The adapter die serves as an intermediary component between the first die and the second die. It contains the power transmission path that mediates the electrical connection, allowing power to be transmitted from a first power transmission region in the first die to a second power transmission region in the second die without requiring direct vertical alignment. The adapter die absorbs the spatial mismatch between the two dies.
2Reliability
If separate power management circuits are provided for each die type (logic die and memory die), then each die receives appropriate power management, but device complexity increases
Solution Approach 1:
The patent merges the power management functions for both the logic die and memory die into a single power management circuit located in the adapter die. This unified circuit can provide different voltage levels to different dies simultaneously, reducing the total number of power management circuits while maintaining appropriate power management for each die type.
Solution Approach 2:
The power management circuit in the adapter die is designed with multi-functionality to serve multiple purposes: it can provide different voltage levels to different dies, act as an intermediary for power transmission, and potentially perform other functions. This universal design reduces overall system complexity while maintaining the ability to manage power for each die type appropriately.
3Ease of manufacture
If logic die is designed based on memory die shape with TSV alignment requirements, then manufacturing consistency is maintained, but arrangement of various sizes of circuit elements becomes difficult
Solution Approach 1:
The patent uses the third dimension (horizontal positioning within the adapter die) to resolve the conflict between manufacturing consistency and circuit element arrangement flexibility. The power transmission path can be routed horizontally within the adapter die to connect vertically stacked dies that are offset in the horizontal plane, allowing logic die to be designed with optimal circuit element placement independent of memory die geometry.
Data Source
AI summary
A stacked IC package includes a first die including a first power transmission region, an adapter die stacked on the first die, a second die stacked on the adapter die and including a second power transmission region, and a first power transmission path electrically connected between the second power transmission region and the first power transmission region through the adapter die. The first power transmission path includes a first power transmission part penetrating a portion of the adapter die in a vertical direction from the first power transmission region, a second power transmission part including a connected part in a horizontal direction from the first power transmission part in the adapter die, and a third power transmission part connected to the second power transmission region in the vertical direction from the second power transmission part. A voltage conversion circuit is arranged on the first power transmission path.