Stacked IC Package Assembly With Shared Inter-Die Cooling
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Solution Overview
Problem
The increasing density of power consumption in microelectronic devices leads to elevated junction temperatures, which can cause performance issues or damage, especially in stacked-die configurations, necessitating effective thermal management solutions that are often limited by large package form factors and area constraints.
Innovation Solution
A shared thermal management solution is implemented for vertically stacked electronic component packages, where a cooling arrangement, such as a micro-channel fluid cold plate or heat pipes, is positioned between the packages to efficiently dissipate heat from both the top and bottom packages, reducing the overall footprint and enabling efficient heat transfer through thermally conductive bonding materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple microelectronic devices are incorporated in close proximity in a stacked-die configuration, then packaging density is improved, but junction temperature increases causing performance issues or damage
Solution Approach 1:
The patent transitions from lateral packaging arrangement to vertical stacked-die configuration, moving the packaging density improvement to the third dimension (vertical stacking) while introducing thermal management challenges that must be addressed through dedicated cooling structures between dies
Solution Approach 2:
The patent introduces intermediate cooling structures (heat spreaders, thermal interface materials, and cooling plates) positioned between stacked dies to facilitate heat transfer from high-density packages to cooling mechanisms, thereby managing junction temperature while maintaining packaging density
2Loss of energy
If traditional thermal management solutions are used for stacked-die configurations, then heat removal is improved, but package form factor increases
Solution Approach 1:
The patent merges the cooling function into the inter-die spacing itself, where cooling plates and heat spreaders are integrated between the stacked dies rather than adding separate cooling components, thereby achieving effective heat removal without increasing overall package volume
Solution Approach 2:
The patent implements nested thermal management structures where heat spreaders are positioned within the inter-die spaces, and cooling plates are integrated into the package substrate, creating a compact nested arrangement that provides comprehensive cooling while minimizing form factor increase
3Temperature
If cooling arrangements are added between stacked packages, then thermal management is improved, but device complexity increases
Solution Approach 1:
The patent designs cooling plates and heat spreaders that serve multiple functions: they provide thermal management between dies, act as mechanical support structures, and facilitate electrical interconnections, thereby improving thermal management without proportionally increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the lateral and vertical footprint on circuit boards, provides effective cooling for high-power devices, and maintains efficient thermal management, preventing performance degradation and damage due to excessive heat, while optimizing the form factor for constrained applications like ultrathin laptops.
Implementation Method 1
a cooling arrangement, such as a micro-channel fluid cold plate or heat pipes, is positioned between the packages to efficiently dissipate heat from both the top and bottom packages
Implementation Method 2
micro-channel fluid cold plate
Implementation Method 3
enabling efficient heat transfer through thermally conductive bonding materials
Data Source
AI summary
An integrated circuit structure that includes a first integrated circuit package and a second integrated circuit package is described. The two packages can be stacked above, for example, a printed circuit board. The top package is inverted, such that a first die of that top package is facing a second die of the bottom package. A cooling arrangement is in a gap between the first and second integrated circuit packages, and is thermally coupled to the first and second die. The cooling arrangement is to transfer heat generated by a first die of the first integrated circuit package and a second die of the second integrated circuit package. In some cases, structures comprising electrically conductive material (e.g., metal) are encapsulated by a molding compound or insulator, and extend between a first substrate of the first integrated circuit package and a second substrate of the second integrated circuit package.