Stacked Image Sensor with Infrared Pass Filter
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Solution Overview
Problem
The integration of depth sensors with image sensors in electronic devices poses design limitations and cost increases due to the need for additional space and complex mounting, which affects the performance and security of these devices.
Innovation Solution
A stacked structure image sensor design that includes a color sensor chip for generating color images and a depth sensor chip for generating depth images, with an infrared light pass filter between them, allowing for efficient transfer of infrared light and improved integration without degrading the performance of the depth sensor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a depth sensor is additionally mounted to an electronic device, then depth sensing capability is improved, but device space requirements increase and design complexity increases
Solution Approach 1:
The patent combines the color sensor chip and depth sensor chip into a single integrated sensor unit. The color sensor chip includes visible light photoelectric conversion elements and infrared light photoelectric conversion elements on the same substrate, merging multiple sensing functions into one component. This integration eliminates the need for separate depth sensor mounting, reducing device space requirements while maintaining both color imaging and depth sensing capabilities.
Solution Approach 2:
The color sensor chip is designed with dual functionality: visible light photoelectric conversion elements generate color images from visible light, while infrared light photoelectric conversion elements generate depth images from infrared light. This multi-functional design allows a single sensor unit to perform both color imaging and depth sensing, improving adaptability without requiring additional dedicated depth sensor space.
2Adaptability or versatility
If a depth sensor is additionally mounted to an electronic device, then depth sensing capability is improved, but manufacturing cost increases
Solution Approach 1:
The patent integrates multiple sensor functions into a single color sensor chip, combining visible light sensing and infrared light sensing in one manufacturing process. This unified approach eliminates the need for separate depth sensor assembly and reduces manufacturing complexity, thereby lowering production costs while achieving both color imaging and depth sensing capabilities.
Solution Approach 2:
The color sensor chip is designed as a universal sensing platform that handles both visible light and infrared light detection. By using a single multi-functional chip rather than separate specialized sensors, the manufacturing process is simplified and costs are reduced, while the device gains versatile depth sensing capability.
3Productivity
If infrared light pass filter is disposed between color sensor chip and depth sensor chip, then infrared light transfer efficiency is improved, but device structure complexity increases
Solution Approach 1:
The patent merges the infrared light pass filter directly into the color sensor chip structure, positioning it between the visible light photoelectric conversion elements and the infrared light photoelectric conversion elements. This integrated filter design eliminates the need for separate filter components and complex mounting structures, reducing overall device structural complexity while maintaining high infrared light transfer efficiency to the depth sensing elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances integration and prevents performance degradation of the depth sensor, enabling effective coexistence of color and depth image generation while minimizing space and cost requirements.
Implementation Method 1
a light transfer layer disposed under the color sensor chip, and including an infrared light pass filter which filters infrared light from light having passed through the color sensor chip
Implementation Method 2
each of the color sensor chip and the depth sensor chip includes a photoelectric conversion element configured to generate photocharges in response to incident light received by the color sensor chip or the depth sensor chip
Data Source
AI summary
An image sensor includes a color sensor chip configured to generate a color image by sensing visible light in incident light; a light transfer layer disposed under the color sensor chip, and including an infrared light pass filter which filters infrared light from light having passed through the color sensor chip; and a depth sensor chip disposed under the light transfer layer, and configured to generate a depth image by sensing the infrared light.