Stacked Image Sensor with Integrated Processor
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Solution Overview
Problem
Existing image sensors require external image processing circuits to apply various image processing techniques, leading to increased complexity and power consumption, as they lack the capability to perform image processing internally.
Innovation Solution
An image sensor configuration where a first substrate with a light receiving unit and an analog/digital converter is stacked with a second substrate containing an image processor, allowing for the receipt and processing of image signals from outside the sensor, including signal amplification, reference level adjustment, and composite image generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If image processing is performed externally using separate image processor chips, then image processing capability is provided, but device complexity and power consumption increase
Solution Approach 1:
The patent merges the image sensor chip and image processor chip into a single stacked semiconductor module. The image processor is positioned adjacent to the image sensor, and signal lines directly connect the pixel electrodes to the image processor, eliminating the need for separate external processing circuits and reducing overall device complexity.
Solution Approach 2:
The image processor in the stacked module is designed to perform multiple image processing functions including signal amplification, reference level adjustment, and composite image generation. This multi-functional design provides versatile image processing capability while avoiding the need for multiple separate processing components.
2Adaptability or versatility
If separate image processor chips are used for image processing, then image processing functions are achieved, but power consumption increases
Solution Approach 1:
By combining the image sensor and image processor into a single stacked module with direct signal line connections, the patent eliminates intermediate signal transmission and reduces the number of active components. This integration reduces overall power consumption while maintaining full image processing capability.
3Extent of automation
If multiple chips are stacked for image processing, then internal processing capability is enabled, but manufacturing complexity increases
Solution Approach 1:
The patent transitions from planar chip arrangement to three-dimensional stacking, positioning the image processor adjacent to and connected with the image sensor through vertical signal lines. This dimensional change enables internal processing capability while managing manufacturing complexity through standardized stacking techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient internal image processing within the sensor, reducing the need for external processing circuits and minimizing power consumption by dispersing processing loads, thus enhancing image processing capabilities without the need for additional hardware.
Implementation Method 1
a pixel unit having photoelectric converters that convert light into electricity
Data Source
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AI summary
An image sensor provided with imaging means including a plurality of photoelectric converters, the image sensor comprises: input means to which image data is input from outside of the image sensor; image processing means that applies image processing to image data obtained from the imaging means and to the image data input from the input means; and output means for outputting, to the outside, image data obtained through the image processing by the image processing means.