Stacked Image Sensor Layout for DSP Noise Isolation
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Solution Overview
Problem
Existing image sensor chips face challenges in advanced processing due to noise intrusion during computation by the DSP, particularly when operating on pre-trained models, leading to image quality deterioration.
Innovation Solution
A stacked light-receiving sensor design with a specific positional arrangement of the pixel array and DSP, where the DSP is positioned to avoid overlap with the pixel array, reducing noise intrusion through optimized wiring and layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If the DSP is integrated on the same substrate as the pixel array to enable advanced image processing, then processing capability is improved, but noise intrusion from the DSP deteriorates image quality
Solution Approach 1:
The patent divides the image sensor into separate functional substrates: a first substrate containing the pixel array and a second substrate containing the DSP and converter. This segmentation physically isolates the noise-generating DSP from the sensitive pixel array, resolving the contradiction between processing capability and noise intrusion.
Solution Approach 2:
The patent transitions from a two-dimensional planar layout to a three-dimensional stacked architecture where the pixel array and DSP are positioned on different substrates in the vertical dimension. This dimensional separation allows both high processing capability and low noise interference to coexist.
2Productivity
If the pixel array and DSP are positioned close together to reduce wiring length, then connection efficiency is improved, but noise interference increases
Solution Approach 1:
By segmenting the sensor into separate substrates, the patent achieves both short connection length (within the stacked structure) and noise isolation (between substrates), resolving the contradiction between transmission efficiency and noise interference.
3Extent of automation
If more processing circuits are added to the chip to enhance functionality, then processing capability is improved, but device complexity increases
Solution Approach 1:
The patent segments complex processing functions onto a separate second substrate, allowing the first substrate to remain simple while achieving advanced processing capabilities through the stacked configuration.
Solution Approach 2:
The converter acts as an intermediary between the pixel array and DSP, managing the interface and data flow between substrates. This mediator simplifies the overall system architecture by providing a standardized communication protocol between the separated functional blocks.
Data Source
AI summary
Advanced processing is performed in a chip. A stacked light-receiving sensor according to an embodiment includes a first substrate (100, 200, 300), a second substrate (120, 320) bonded to the first substrate, and connection wiring (402) bonded to the second substrate. The first substrate includes a pixel array (101) in which a plurality of unit pixels are arranged in a two-dimensional matrix. The second substrate includes a converter (17A) configured to convert an analog pixel signal output from the pixel array to digital image data and a processing unit (14) configured to perform a process for data based on the image data. At least a part of the converter is disposed on a first side in the second substrate. The processing unit is disposed on a second side opposite to the first side in the second substrate. The connection wiring is attached to a side other than the second side in the second substrate.