Stacked Image Sensor Output Layout for Smaller Terminal Footprint
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Solution Overview
Problem
The downsizing of solid-state imaging apparatuses is hindered by the increasing size of terminal units for outputting signals, which occupy more plane space.
Innovation Solution
A solid-state imaging apparatus is configured by laminating a structure body with a pixel array unit for photoelectric conversion and an output circuit unit, where the output circuit unit is connected to signal output terminals via through vias penetrating the semiconductor substrate, and the outer surface is covered with a resin or antireflection film, allowing for a more compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the terminal unit for outputting signals is enlarged to accommodate signal output terminals, then the signal output capability is improved, but the plane area occupied increases, making downsizing difficult
Solution Approach 1:
The patent transitions from a planar arrangement of signal terminals to a three-dimensional stacked configuration. The first and second structure bodies are laminated vertically, with signal terminals arranged in different layers (first terminals on the first structure body, second terminals on the second structure body). This vertical stacking in the third dimension reduces the plane area occupied by terminals while maintaining signal output capability.
Solution Approach 2:
The patent divides the structure into two separate structure bodies (first and second structure bodies) that are laminated together. Each structure body contains its own set of signal terminals, allowing the terminal functions to be segmented across different layers rather than concentrated in a single plane, thereby reducing the occupied plane area.
2Area of stationary object
If multiple structure bodies are laminated to reduce plane area, then the compactness is improved, but the device complexity increases
Solution Approach 1:
The patent combines multiple structure bodies into a single integrated device through lamination. The first and second structure bodies are bonded together to form a unified structure that functions as one complete imaging device, reducing the overall plane area while managing complexity through systematic integration.
Solution Approach 2:
Each structure body serves multiple functions: the first structure body contains both pixel units for image capture and first signal terminals for output, while the second structure body contains second signal terminals and support structures. This multi-functionality reduces the need for separate dedicated components, managing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables further downsizing of the apparatus by optimizing the layout and reducing the space required for signal output terminals, enhancing the compactness of the device.
Implementation Method 1
the output circuit unit is connected to the signal output external terminal via the through via
Implementation Method 2
a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned
Data Source
AI summary
The present disclosure relates to reducing the size of a solid-state imaging apparatus. The solid-state imaging apparatus is configured by laminating a first structure body, comprising a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned, and a second structure body, comprising an output circuit unit for outputting a pixel signal. The output circuit unit, including a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the first structure body, the output circuit unit is connected to the signal output external terminal via the through via, and the outermost surface of the apparatus is a resin layer formed on an upper layer of an on-chip lens of the pixel array unit.