Stacked Image Sensor and Processor Subsystem for Low Power Transmission

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Solution Overview

Problem

Existing optical image capture and transmission systems face issues with high power consumption, long conducting paths limiting operating frequency, and complex fabrication due to multiple components, which hinder performance and efficiency.

Innovation Solution

A stack configuration of image sensor, processor, memory, and wireless units, fabricated using the same semiconductor process, reduces power consumption and complexity, enabling improved frequency response and compact design, with optional integration of CMOS technology for further optimization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If components are integrated on a circuit board with long conducting paths, then the system can be assembled with separate components, but the operating frequency is limited and power consumption increases

Engineering Contradiction:
Improvecomponent assemblyVSAvoidoperating frequency
Core Design Contradiction:
Ease of manufactureVSSpeed

Solution Approach 1:

The patent merges the image sensor, processor, memory, and wireless units into a single integrated circuit substrate. This eliminates the need for separate components and long conducting paths, thereby increasing the operating frequency while reducing power consumption. The integration is achieved through shared fabrication processes and common substrate architecture.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from a planar circuit board layout to a three-dimensional stacked architecture. Multiple functional layers are stacked vertically, allowing short interconnections within the stack while maintaining compact footprint. This dimensional change enables higher operating frequencies by reducing parasitic inductance and capacitance of long traces.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If multiple separate components are used in the system, then each component can be optimized independently, but the fabrication complexity increases

Engineering Contradiction:
Improvecomponent optimizationVSAvoidfabrication complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent employs a universal CMOS fabrication process that can manufacture all components (image sensor, processor, memory, wireless units) using the same manufacturing workflow. This multi-functional approach simplifies fabrication by eliminating the need for separate fabrication lines while still allowing each component to be optimized for its specific function through design-level adjustments.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Loss of information

If optical images are transmitted directly, then the complete image data is conveyed, but the power consumption and data transmission burden increase

Engineering Contradiction:
Improveimage data completenessVSAvoidtransmission power consumption
Core Design Contradiction:
Loss of informationVSUse of energy by moving object

Solution Approach 1:

The patent extracts only the essential information from captured optical images for transmission, rather than transmitting the complete image data. The processor analyzes images and transmits only critical data such as detection results or summarized information, thereby reducing transmission power consumption and data burden while maintaining necessary information integrity.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution results in a more efficient, compact, and cost-effective optical image acquisition and transmission system with reduced power consumption and simplified fabrication, enabling the creation of small, portable monitoring devices that can transmit information derived from images rather than the images themselves, enhancing detection capabilities.

Implementation Method 1

an image sensor unit having photoreceptors for receiving optical images

Methodology Applied
Scientific EffectPhotoelectric Effect: Photoelectric Effect

Data Source

PatentUS7556442B2Apparatus and method for a smart image-receptor unit
Publication Date: 2009.07.07 TEXAS INSTRUMENTS INC
  • US7556442B2 patent drawing
  • US7556442B2 patent drawing
  • US7556442B2 patent drawing

AI summary

In an optical image acquisition and information transmission system, the system components can be fabricated, according to a first implementation, in a stack positioned on a circuit board. According to a second implementation, the system components are fabricated on a single substrate using the same semiconductor processes for each component. Both implementations result in better performance parameters. These systems are particularly useful as control devices wherein information resulting from processing the acquired image rather than the image itself is transmitted.