Stacked Solid-State Image Sensor Layout for Smaller Output Terminals
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Solution Overview
Problem
As solid-state imaging apparatuses become smaller, the area of terminal portions from which output signals are extracted increases relative to the horizontal size, making it difficult to further reduce the apparatus size.
Innovation Solution
A solid-state imaging apparatus is designed with a laminate structure where the pixel conversion units are on one semiconductor substrate and signal processing units are on another, with input/output circuits integrated on a separate substrate, allowing for a cavity-less design and efficient wiring connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the apparatus size is reduced, then the overall dimensions become smaller, but the terminal portion area increases relative to the horizontal size
Solution Approach 1:
The patent applies dimensionality change by transitioning from a planar terminal arrangement to a three-dimensional vertical structure. Through-holes penetrating the substrate allow terminal portions to extend in the vertical dimension, enabling multiple terminals to be stacked along the depth direction. This resolves the contradiction by maintaining compact horizontal footprint while accommodating sufficient terminal area through vertical stacking.
Solution Approach 2:
The patent implements nesting by placing terminal portions inside through-holes that penetrate the substrate. The terminal portions are nested within the substrate thickness, utilizing the internal volume of the substrate rather than occupying additional horizontal space. This allows the apparatus to maintain small horizontal dimensions while providing adequate terminal area for signal extraction.
2Productivity
If multiple semiconductor substrates are laminated, then integration density increases, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the imaging apparatus into multiple functional semiconductor substrates that are laminated together. Each substrate contains specific functional blocks (e.g., pixel array, signal processing circuits, memory), allowing independent design, fabrication, and testing of each layer before assembly. This segmentation enables high integration density while managing manufacturing complexity through modular construction.
Solution Approach 2:
The patent uses intermediary connection structures, specifically through-holes with conductive fillings, to bridge electrical connections between laminated substrates. These intermediary elements facilitate signal transmission across multiple layers without requiring complex direct bonding interfaces, thereby enabling high integration density while simplifying the manufacturing process through standardized connection methods.
Data Source
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AI summary
The present disclosure relates to a solid-state imaging apparatus, a manufacturing method of the same and an electronic device which can make an apparatus size further smaller. A solid-state imaging apparatus includes: a laminate of a first structure (11) in which a pixel array unit in which pixels that perform photoelectric conversion are two-dimensionally arranged is formed and a second structure (12) in which an output circuit unit configured to output pixel signals output from the pixels to an outside of an apparatus is formed. The output circuit unit, a first through hole via (85) which penetrates through a semiconductor substrate (81) constituting part of the second structure, and an external terminal (14) for signal output connected to the outside of the apparatus are disposed below the pixel array unit of the first structure. The present disclosure can be applied, for example, to a solid-state imaging apparatus or the like.