Stacked Image Sensor Thermal Layer for Noise Suppression
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Solution Overview
Problem
Heat generated in the signal processing and image processing circuits of conventional image capturing devices leads to increased noise and image quality degradation due to heat transfer to the photoelectric converting units.
Innovation Solution
A stacked structure with a heat conduction layer having higher conductivity than the insulating layer is introduced between the signal processing and image processing circuits to dissipate heat away from the photoelectric converting units, using materials like copper, silver, or aluminum.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If signal processing circuits and image processing circuits are stacked close to the photoelectric converting units, then device integration and signal processing efficiency are improved, but heat generated in the circuits transfers to the photoelectric converting units causing noise and image quality degradation
Solution Approach 1:
An insulating layer is introduced between the second circuit (image processing circuit) and the second layer (containing first circuit and photoelectric converting units) to block heat transfer. Additionally, a heat conduction layer with higher heat conductivity than the insulating layer is provided within the insulating layer to conduct heat away from the photoelectric converting units, effectively mediating the thermal interaction between the circuits and the photoelectric converting units.
2Temperature
If heat conduction layer is added to dissipate heat, then temperature rise in photoelectric converting units is suppressed, but device complexity increases
Solution Approach 1:
The heat conduction layer is merged with the insulating layer, where the heat conduction layer is provided within the insulating layer. This combination allows the insulating layer to simultaneously perform both heat insulation (blocking heat transfer from the second circuit) and heat conduction (dissipating heat away from photoelectric converting units), reducing the need for separate components and simplifying the overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat conduction layer effectively dissipates heat generated in the signal and image processing circuits, preventing noise and maintaining image quality by suppressing temperature rise in the photoelectric converting units.
Implementation Method 1
a heat conduction layer with higher heat conductivity than the insulating layer provided in the insulating layer
Implementation Method 2
a photoelectric converting unit configured to photoelectrically convert light and produce electric charges
Data Source
AI summary
An image capturing device includes: a first layer, including a photoelectric converting unit configured to photoelectrically convert light and produce electric charges; a second layer, stacked with the first layer, including a first circuit configured to process a signal based on electric charges produced by the photoelectric converting unit; and a third layer, stacked with the second layer, including an insulating layer provided between a second circuit for processing a signal processed by the first circuit and the second layer, and a heat conduction layer with higher heat conductivity than the insulating layer provided in the insulating layer.